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NTS0104GU12

NXP Semiconductors

NTS0104GU12 by NXP Semiconductors

The NXP Semiconductors NTS0104GU12 is a network interface chip carrier with 4 functions, suitable for automotive applications. It operates b/w -40 to 125°C, with a nominal voltage of 3.3V. This surface-mountable device has a rectangular shape and quad terminal position, making it ideal for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 43,500 parts In-Stock

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Digiode

USA . 4,736 parts In-Stock

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Vyrian

USA . 1,346 parts In-Stock

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Anansix

USA . 1,091 parts In-Stock

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Nova Conductors

Japan . 89 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 751 parts In-Stock

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$14.839

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751

$14.839

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Aztec Data Supply Inc.

USA . 4,272 parts In-Stock

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$14.980

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Corohmni

South Africa . 374 parts In-Stock

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$16.884

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374

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Semicontronic

India . 841 parts In-Stock

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$348.000

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$339.300

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$337.560

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841

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Ampacity Inc.

Singapore . 255 parts In-Stock

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$538.000

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One Stop Electronics

USA . 1,379 parts In-Stock

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$749.000

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Kepictronics

USA . 20,000 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Lixinc

USA . 12,911 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,664 parts In-Stock

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Argo Parts USA

USA . 4,480 parts In-Stock

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Continental Prestige Electronics

USA . 4,374 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,042 parts In-Stock

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UNI Independent Distributors

Spain . 1,555 parts In-Stock

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Corphita

USA . 1,402 parts In-Stock

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Futuretech Components

Singapore . 1,300 parts In-Stock

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GreenTree Electronics

Israel . 860 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Enhance your networking experience with the NTS0104GU12 by NXP Semiconductors. Manufactured with top-notch quality and expertise, this network interface device offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides seamless connectivity and functionality, making it a valuable addition to any project. Experience the benefits of superior technology and innovation with the NTS0104GU12, designed to exceed expectations and elevate your networking solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material ensures durability and resistance to damage, making this network interface reliable for long-term use.

Surface Mount: YES

With surface mount capability, this network interface can be easily integrated into printed circuit boards, providing a compact and efficient design solution.

No. of Functions: 4

Having 4 functions in one package increases the functionality of this network interface, allowing for more versatile networking capabilities.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of space on a circuit board and allows for easy alignment during installation, enhancing the overall usability of this network interface.

No. of Terminals: 12

With 12 terminals available, this network interface offers a sufficient number of connection points for various networking applications, ensuring compatibility with different systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the reliability of this network interface in a wide range of environmental conditions, making it suitable for industrial and automotive use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this network interface to function effectively in harsh cold environments, increasing its versatility and applicability.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection for the network interface, reducing the risk of signal loss or interference, resulting in consistent and reliable performance.

Width: 1.7 mm

The compact width of 1.7 mm enables this network interface to be easily integrated into smaller devices or circuit boards, saving space and facilitating efficient design solutions.

Length: 2 mm

With a length of 2 mm, this network interface offers a compact form factor, making it suitable for applications where space is limited, without compromising on functionality.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this network interface meets the stringent temperature requirements and durability standards of the automotive industry, ensuring reliable performance in automotive environments.

Terminal Form: NO LEAD

The no lead terminal form reduces the risk of solder joint cracking and improves the overall reliability of this network interface, making it suitable for high-vibration environments or applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, this network interface offers compatibility with standard voltage levels, making it easy to integrate into existing systems or designs.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4 mm, this network interface provides a fine-pitch connection that allows for higher density integration on circuit boards, enabling more compact and efficient designs.

Technical Specifications

Network Interfaces NTS0104GU12 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PQCC-N12

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

1.7 mm

Trade Compliance

NTS0104GU12 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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