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MRF7S19170HSR3

NXP Semiconductors

MRF7S19170HSR3 by NXP Semiconductors

The NXP Semiconductors MRF7S19170HSR3 is a single N-channel RF Power FET with ceramic-metal-sealed co-fired package. Operating in enhancement mode, it offers L band frequency range and can withstand up to 225°C. Ideal for flange mount applications requiring high power and efficiency.

Median Price

$113.545

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MRF7S19170HSR3 by NXP Semiconductors
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Verical

USA . 105 parts In-Stock

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$109.200

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Rochester

USA . 37 parts In-Stock

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$117.890

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$105.480

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$99.270

37

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$99.270

DigiKey

USA . 37 parts In-Stock

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Digiode

USA . 4,522 parts In-Stock

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$101.052

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Vyrian

USA . 3,742 parts In-Stock

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Anansix

USA . 899 parts In-Stock

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899

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Voyager Components

USA . 100 parts In-Stock

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Ampacity Inc.

Singapore . 60 parts In-Stock

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$91.440

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Corphita

USA . 2,735 parts In-Stock

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$95.733

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$95.733

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Continental Prestige Electronics

USA . 37 parts In-Stock

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$157.570

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Authorized Procurement Solutions

USA . 75,990 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,627 parts In-Stock

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Microchip USA

USA . 6,493 parts In-Stock

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UNI Independent Distributors

Spain . 4,674 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,526 parts In-Stock

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Futuretech Components

Singapore . 877 parts In-Stock

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Metaverse IC Inc.

Canada . 595 parts In-Stock

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Perfect Parts

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Overview

Boost your RF power applications with the MRF7S19170HSR3 by NXP Semiconductors. This top-of-the-line RF Power FET offers unparalleled quality and performance, making it the go-to choice for professionals in the industry. Its ceramic, metal-sealed co-fired package ensures reliability and durability, while its N-channel configuration delivers optimal efficiency. Whether you're working in telecommunications or radar systems, this Enhancement Mode transistor will elevate your projects to new heights. Trust NXP Semiconductors for cutting-edge technology that delivers exceptional value and unbeatable results.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent thermal conductivity and reliability, making the product suitable for high-power applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and higher efficiency compared to P-channel FETs, making them a preferred choice for RF power applications.

Configuration: SINGLE

The single configuration simplifies the design and layout of the circuit, making it more efficient and cost-effective.

Package Shape: RECTANGULAR

The rectangular package shape offers easy integration into circuit boards and allows for efficient use of space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology provides high gain, low noise performance, and excellent thermal stability, making it ideal for RF power applications.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF7S19170HSR3 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-CDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Element Material:

SILICON

Trade Compliance

MRF7S19170HSR3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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