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MRF7S19100NR1

NXP Semiconductors

MRF7S19100NR1 by NXP Semiconductors

N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Minimum DS Breakdown Voltage: 65 V; No. of Elements: 1;

Median Price

$41.020

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

MRF7S19100NR1 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 500 parts In-Stock

1+ parts

$19.420

100+ parts

$16.650

1k+ parts

-

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500

$19.420

$16.650

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Rochester

USA . 3,387 parts In-Stock

1+ parts

-

100+ parts

$41.020

1k+ parts

$36.700

10k+ parts

$34.540

3,387

-

$41.020

$36.700

$34.540

DigiKey

USA . 3,387 parts In-Stock

1+ parts

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3,387

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Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$51.275

1k+ parts

$45.875

10k+ parts

$43.175

2,000

-

$51.275

$45.875

$43.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,901 parts In-Stock

1+ parts

$14.570

100+ parts

-

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2,901

$14.570

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Digiode

USA . 1,948 parts In-Stock

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$18.449

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$18.449

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Anansix

USA . 2,615 parts In-Stock

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2,615

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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Sensible Micro Corp

USA . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,003 parts In-Stock

1+ parts

$12.380

100+ parts

-

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1,003

$12.380

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Corphita

USA . 2,949 parts In-Stock

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$17.478

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$17.478

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Component Stockers USA

USA . 2,639 parts In-Stock

1+ parts

$47.240

100+ parts

$44.400

1k+ parts

$40.160

10k+ parts

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2,639

$47.240

$44.400

$40.160

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Continental Prestige Electronics

USA . 3,387 parts In-Stock

1+ parts

$54.830

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3,387

$54.830

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Microchip USA

USA . 7,052 parts In-Stock

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$100.901

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7,052

$100.901

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A-Z Elektronik GmbH

Germany . 6,861 parts In-Stock

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6,861

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UNI Independent Distributors

Spain . 6,596 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Futuretech Components

Singapore . 877 parts In-Stock

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877

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Kepictronics

USA . 94 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Technical Specifications

RF Power Field Effect Transistors (FET) MRF7S19100NR1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JEDEC-95 Code:

TO-270

JESD-30 Code:

R-PDFM-F4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF7S19100NR1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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