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MPC875ZT133

NXP Semiconductors

MPC875ZT133 by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

Median Price

$26.420

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28 parts In-Stock

1+ parts

-

100+ parts

$25.350

1k+ parts

$22.680

10k+ parts

$21.340

28

-

$25.350

$22.680

$21.340

DigiKey

USA . 28 parts In-Stock

1+ parts

-

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-

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28

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-

-

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Farnell

UK . 28 parts In-Stock

1+ parts

-

100+ parts

$26.420

1k+ parts

-

10k+ parts

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28

-

$26.420

-

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Verical

USA . 28 parts In-Stock

1+ parts

-

100+ parts

$31.688

1k+ parts

$28.350

10k+ parts

$26.675

28

-

$31.688

$28.350

$26.675

Flip Electronics (Authorized)

USA . 9 parts In-Stock

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9

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,292 parts In-Stock

1+ parts

$26.809

100+ parts

-

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4,292

$26.809

-

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Vyrian

USA . 4,317 parts In-Stock

1+ parts

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4,317

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Anansix

USA . 1,194 parts In-Stock

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1,194

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DigiKey Marketplace

USA . 28 parts In-Stock

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28

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Electronics Depot

USA . 25 parts In-Stock

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25

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Flip Electronics

USA . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 4,317 parts In-Stock

1+ parts

$23.700

100+ parts

$22.760

1k+ parts

$22.310

10k+ parts

$21.860

4,317

$23.700

$22.760

$22.310

$21.860

Corphita

USA . 4,130 parts In-Stock

1+ parts

$25.398

100+ parts

-

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4,130

$25.398

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Vigor

Singapore . 780 parts In-Stock

1+ parts

$27.090

100+ parts

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780

$27.090

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Component Stockers USA

USA . 27 parts In-Stock

1+ parts

$28.610

100+ parts

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27

$28.610

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A-Z Elektronik GmbH

Germany . 6,831 parts In-Stock

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6,831

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Microchip USA

USA . 3,839 parts In-Stock

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3,839

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UNI Independent Distributors

Spain . 2,518 parts In-Stock

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2,518

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Technical Specifications

Microprocessors MPC875ZT133 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,50

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Speed:

133 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

MPC875ZT133 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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