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MPC8544CVJANGA

NXP Semiconductors

MPC8544CVJANGA by NXP Semiconductors

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$150.740

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 33 parts In-Stock

1+ parts

$150.740

100+ parts

$141.700

1k+ parts

$132.650

10k+ parts

-

33

$150.740

$141.700

$132.650

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,088 parts In-Stock

1+ parts

$151.164

100+ parts

-

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4,088

$151.164

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Vyrian

USA . 3,545 parts In-Stock

1+ parts

-

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3,545

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Anansix

USA . 755 parts In-Stock

1+ parts

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755

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Flip Electronics

USA . 62 parts In-Stock

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-

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62

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,103 parts In-Stock

1+ parts

$14.380

100+ parts

-

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1,103

$14.380

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Corphita

USA . 433 parts In-Stock

1+ parts

$143.208

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433

$143.208

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Component Stockers USA

USA . 13 parts In-Stock

1+ parts

$183.730

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13

$183.730

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Microchip USA

USA . 1,193 parts In-Stock

1+ parts

$202.162

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1,193

$202.162

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Vigor

Singapore . 886 parts In-Stock

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$286.413

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886

$286.413

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UNI Independent Distributors

Spain . 5,998 parts In-Stock

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5,998

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Technical Specifications

Microprocessors MPC8544CVJANGA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

JESD-609 Code:

e2

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN SILVER

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MPC8544CVJANGA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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