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MPC8541EPXAJD

NXP Semiconductors

MPC8541EPXAJD by NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: HBGA; Package Shape: RECTANGULAR;

Median Price

$151.160

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

MPC8541EPXAJD by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 684 parts In-Stock

1+ parts

$138.740

100+ parts

$130.420

1k+ parts

$122.090

10k+ parts

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684

$138.740

$130.420

$122.090

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Flip Electronics (Authorized)

USA . 1,924 parts In-Stock

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1,924

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DigiKey

USA . 684 parts In-Stock

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684

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Farnell

UK . 684 parts In-Stock

1+ parts

-

100+ parts

$151.160

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684

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$151.160

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Verical

USA . 684 parts In-Stock

1+ parts

-

100+ parts

$163.025

1k+ parts

$157.813

10k+ parts

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684

-

$163.025

$157.813

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,279 parts In-Stock

1+ parts

$151.160

100+ parts

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2,279

$151.160

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Digiode

USA . 958 parts In-Stock

1+ parts

$153.416

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958

$153.416

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Anansix

USA . 2,112 parts In-Stock

1+ parts

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2,112

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Flip Electronics

USA . 1,924 parts In-Stock

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1,924

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ACDS - Activité Composants Distribution Service

France . 72 parts In-Stock

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72

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Electronics Depot

USA . 30 parts In-Stock

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30

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Bristol Electronics

USA . 18 parts In-Stock

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Semi Source

USA . 5 parts In-Stock

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5

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Lakeland Logistics Inc

USA . 2 parts In-Stock

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2

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Lantek

USA . 2 parts In-Stock

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2

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Component Sense

UK . 1 parts In-Stock

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1

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Distributors (Availability)

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One Stop Electronics

USA . 651 parts In-Stock

1+ parts

$128.490

100+ parts

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651

$128.490

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Corphita

USA . 4,829 parts In-Stock

1+ parts

$145.341

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4,829

$145.341

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Vigor

Singapore . 269 parts In-Stock

1+ parts

$155.020

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269

$155.020

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Component Stockers USA

USA . 504 parts In-Stock

1+ parts

$164.980

100+ parts

$155.080

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504

$164.980

$155.080

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QUARKTWIN TECHNOLOGY LTD

USA . 28,111 parts In-Stock

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28,111

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Metaverse IC Inc.

Canada . 8,539 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,396 parts In-Stock

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6,396

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Microchip USA

USA . 5,259 parts In-Stock

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5,259

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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1,800

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UNI Independent Distributors

Spain . 409 parts In-Stock

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409

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Perfect Parts

USA . 161 parts In-Stock

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161

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Cyclops Electronics Ltd (Excess)

UK . 72 parts In-Stock

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72

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Technical Specifications

Microprocessors MPC8541EPXAJD attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

64

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

166 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B783

JESD-609 Code:

e0

Length:

29 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

783

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Speed:

533 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

29 mm

Peripheral IC Type:

Trade Compliance

MPC8541EPXAJD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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