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MHT1006NT1

NXP Semiconductors

MHT1006NT1 by NXP Semiconductors

NXP Semiconductors' MHT1006NT1 is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage and 20dB Power Gain. Ideal for AMPLIFIER applications in S BAND, it operates in ENHANCEMENT MODE at -40 to 150 °C, featuring a PLASTIC/EPOXY package and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$12.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 972 parts In-Stock

1+ parts

$15.180

100+ parts

$11.781

1k+ parts

$10.480

10k+ parts

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972

$15.180

$11.781

$10.480

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Rochester

USA . 4,345 parts In-Stock

1+ parts

-

100+ parts

$10.580

1k+ parts

$9.470

10k+ parts

$8.910

4,345

-

$10.580

$9.470

$8.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,776 parts In-Stock

1+ parts

$11.200

100+ parts

-

1k+ parts

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2,776

$11.200

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-

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Vyrian

USA . 2,645 parts In-Stock

1+ parts

$11.790

100+ parts

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2,645

$11.790

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Anansix

USA . 684 parts In-Stock

1+ parts

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684

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,006 parts In-Stock

1+ parts

$10.020

100+ parts

-

1k+ parts

-

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4,006

$10.020

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One Stop Electronics

USA . 4,001 parts In-Stock

1+ parts

$10.020

100+ parts

-

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4,001

$10.020

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Corphita

USA . 592 parts In-Stock

1+ parts

$10.611

100+ parts

-

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592

$10.611

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Component Stockers USA

USA . 2,892 parts In-Stock

1+ parts

$14.160

100+ parts

$13.320

1k+ parts

$12.050

10k+ parts

-

2,892

$14.160

$13.320

$12.050

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Continental Prestige Electronics

USA . 4,370 parts In-Stock

1+ parts

-

100+ parts

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4,370

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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UNI Independent Distributors

Spain . 1,381 parts In-Stock

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1,381

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Overview

Unlock the power of RF amplification with the MHT1006NT1 by NXP Semiconductors. This high-quality RF Power Field Effect Transistor offers unparalleled performance and reliability in a compact package. Ideal for amplifier applications in the S Band, this N-Channel transistor boasts a minimum DS Breakdown Voltage of 65V and a minimum Power Gain of 20dB. With its enhancement mode operation and durable construction, the MHT1006NT1 provides exceptional value and benefits to customers seeking top-notch RF solutions. Elevate your designs with NXP Semiconductors' trusted expertise and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various environments and handling conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better conductivity and efficiency compared to P-channel transistors, making this product a good choice for applications requiring high performance.

Configuration: SINGLE

A single configuration simplifies circuit design and integration, making it easier to use in amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, ensuring optimal performance in amplification circuits.

Surface Mount: YES

Surface mountable design allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage: 65 V

With a high breakdown voltage, this transistor can handle higher voltages without damage, ensuring reliability in various operating conditions.

Minimum Power Gain (Gp): 20 dB

High power gain indicates strong amplification capabilities, making this transistor suitable for applications requiring signal boost.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy integration into circuit layouts and board designs, enhancing overall system efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low power consumption, making this transistor energy-efficient and suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without performance degradation, ensuring reliability in demanding conditions.

Minimum Operating Temperature: -40 °C

A wide operating temperature range allows this transistor to function effectively in both hot and cold environments, providing versatility in application use.

Terminal Finish: TIN

Tin finish on terminals enhances solderability and conductivity, ensuring reliable electrical connections for optimal performance.

Technical Specifications

RF Power Field Effect Transistors (FET) MHT1006NT1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Minimum Power Gain (Gp):

20 dB

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MHT1006NT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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