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MHT1004NR3

NXP Semiconductors

MHT1004NR3 by NXP Semiconductors

RF Power Field-Effect Transistors; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;

Median Price

$136.550

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 156 parts In-Stock

1+ parts

$136.550

100+ parts

$128.360

1k+ parts

$116.070

10k+ parts

-

156

$136.550

$128.360

$116.070

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DigiKey

USA . 156 parts In-Stock

1+ parts

-

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156

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Distributors (In-Stock)

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Digiode

USA . 741 parts In-Stock

1+ parts

$129.722

100+ parts

-

1k+ parts

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741

$129.722

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Vyrian

USA . 2,627 parts In-Stock

1+ parts

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2,627

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Anansix

USA . 1,432 parts In-Stock

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1,432

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,173 parts In-Stock

1+ parts

$122.895

100+ parts

-

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3,173

$122.895

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Continental Prestige Electronics

USA . 158 parts In-Stock

1+ parts

$156.070

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158

$156.070

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Microchip USA

USA . 470 parts In-Stock

1+ parts

$187.260

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470

$187.260

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UNI Independent Distributors

Spain . 4,164 parts In-Stock

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4,164

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Perfect Parts

USA . 286 parts In-Stock

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286

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Technical Specifications

RF Power Field Effect Transistors (FET) MHT1004NR3 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MHT1004NR3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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Authentic purchasing experiences

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