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I74F00N

NXP Semiconductors

I74F00N by NXP Semiconductors

I74F00N from NXP Semiconductors is a TTL logic gate with 4 functions and 2 inputs, operating at a nominal voltage of 5V. It features a fast propagation delay of 6.5 ns and supports industrial applications with a temp range of -40 °C to 85 °C. Packaged in a rectangular, through-hole design, it ensures reliable performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 5,751 parts In-Stock

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Digiode

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Anansix

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Speed Components Ltd

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AZTECH Wire

Italy . 13,434 parts In-Stock

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$5.380

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One Stop Electronics

USA . 328 parts In-Stock

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Corphita

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Supply Digital

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Overview

Elevate your projects with the I74F00N from NXP Semiconductors, a trusted leader in innovative technology. This versatile logic gate enhances efficiency and reliability across various applications, ensuring seamless performance under demanding conditions. With its exceptional durability and temperature resilience, the I74F00N promises unmatched quality that empowers engineers to build robust solutions with confidence, driving success in every endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and robustness in various environments.

No. of Functions: 4

With four functions available, this logic gate can efficiently perform multiple operations, optimizing circuit design.

No. of Inputs: 2

The dual-input feature allows for versatile logic combinations, enhancing usability in diverse applications.

Package Shape: RECTANGULAR

The rectangular shape makes it compatible with standard circuit layouts and facilitates easy integration.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V ensures compatibility with most digital systems.

Load Capacitance (CL): 50 pF

A low load capacitance allows for faster switching speeds, improving overall circuit performance.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options for complex circuits, enhancing versatility.

Package Style (Meter): IN-LINE

The in-line package style simplifies PCB layout and assembly, reducing manufacturing complexity.

Propagation Delay (tpd): 6.5 ns

A short propagation delay of 6.5 ns ensures rapid signal processing, making it suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in warmer conditions.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C ensures functionality in extreme conditions, making it ideal for industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances reliability and prevents corrosion, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning optimizes layout and can simplify routing in PCB designs.

Maximum Seated Height: 4.2 mm

A compact seated height facilitates dense circuit designs without compromising on performance.

Width: 7.62 mm

The standard width allows for compatibility with various board designs and component placements.

Minimum Supply Voltage (Vsup): 4.5 V

A low minimum voltage requirement makes it adaptable to lower power supply situations.

Length: 19.025 mm

The standard length fits well in existing applications and supports modularity in design.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures ensures that it can withstand harsh operating environments.

Technology: TTL

Using TTL technology provides stable and fast switching, suitable for various digital applications.

Terminal Form: THROUGH-HOLE

Through-hole design enhances mechanical stability and is easier to work with during prototyping.

Terminal Pitch: 2.54 mm

A standard terminal pitch supports easy integration with PCB layouts and existing components.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V protects from over-voltage issues while maximizing operational flexibility.

Maximum Power Supply Current (ICC): 10.2 mA

A maximum current rating of 10.2 mA allows for efficient power consumption, suitable for energy-conscious designs.

Technical Specifications

Logic Gates I74F00N attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

10.2 mA

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

I74F00N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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