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I74F32N

Onsemi

I74F32N by Onsemi

The Onsemi I74F32N is a TTL logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 4.5V to 5.5V, with a max power supply current of 15.5mA. With a propagation delay of 6.6ns, it is commonly used in industrial applications requiring fast signal processing and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,992 parts In-Stock

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Digiode

USA . 2,920 parts In-Stock

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Anansix

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AZTECH Wire

Italy . 5,992 parts In-Stock

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$5.630

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One Stop Electronics

USA . 400 parts In-Stock

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$50.000

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UNI Independent Distributors

Spain . 7,551 parts In-Stock

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Corphita

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Problanco Electronics

Mexico . 6,258 parts In-Stock

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Kulean Microsystems

USA . 4,131 parts In-Stock

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TANS Electronics

Latvia . 3,109 parts In-Stock

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Supply Digital

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SupplyDigital Components

Austria . 951 parts In-Stock

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UHIMA Technologies

Türkiye . 759 parts In-Stock

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Corohmni

South Africa . 226 parts In-Stock

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Overview

Elevate your projects with the I74F32N logic gates from Onsemi, providing unmatched quality and reliability in a compact package. With four functions and two inputs, this versatile component is perfect for a wide range of applications. Backed by Onsemi's reputation for excellence, the I74F32N delivers exceptional performance, efficiency, and value to customers. Experience seamless integration and enhanced functionality with this innovative product, designed to meet the demands of industrial-grade applications. Choose Onsemi for superior logic gates that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the logic gates, ensuring long-term reliability.

No. of Functions: 4

Having 4 functions in one package allows for more complex logic operations to be performed using fewer components, saving space and reducing cost.

No. of Inputs: 2

With 2 inputs, the logic gates can easily handle binary logic operations, making them versatile for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems and makes integration easier.

Propagation Delay (tpd): 6.6 ns

The low propagation delay of 6.6 ns allows for fast operation and reduces the time delays in signal processing, enhancing overall system performance.

Technology: TTL

Using TTL technology provides a robust and reliable logic gate solution with well-established standards and compatibility.

Technical Specifications

Logic Gates I74F32N attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

F/FAST

JESD-30 Code:

R-PDIP-T14

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

15.5 mA

Propagation Delay (tpd):

6.6 ns

Schmitt Trigger:

NO

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

I74F32N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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