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I74F04D-T

NXP Semiconductors

I74F04D-T by NXP Semiconductors

I74F04D-T by NXP Semiconductors is a TTL logic gate with 6 functions, ideal for industrial applications. It operates at a nominal voltage of 5V and features an 8 ns propagation delay. This surface-mount device supports temperatures from -40 °C to 85 °C.

Median Price

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4

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1k+

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Vyrian

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North Shore Components

USA . 1,769 parts In-Stock

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Anansix

USA . 1,708 parts In-Stock

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Digiode

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One Stop Electronics

USA . 1,126 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Unlock seamless performance with the I74F04D-T from NXP Semiconductors, a trusted leader in innovative logic solutions. Designed for versatility, this reliable component excels in a wide range of applications from industrial controls to consumer electronics. Its robust design ensures longevity under extreme conditions, while low propagation delay enhances system responsiveness. Elevate your projects with NXP's commitment to quality and innovation—experience efficiency like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protection from environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, making it ideal for high-density applications.

No. of Functions: 6

Multiple functions allow for versatile applications and reduce the need for extra components in circuits.

Package Shape: RECTANGULAR

The rectangular shape is efficient for space management on PCBs, allowing for optimal layout design.

Nominal Supply Voltage / Vsup: 5 V

Standard voltage ensures compatibility with a wide range of electronic systems and simplifies design specifications.

Load Capacitance (CL): 50 pF

A low load capacitance enhances switching speed, making this logic gate suitable for high-speed applications.

No. of Terminals: 14

The 14-terminal configuration provides flexibility in design and circuit integration for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is conducive to compact applications, saving board space without sacrificing performance.

Propagation Delay (tpd): 8 ns

Fast propagation delay enables high-speed data processing, improving the overall efficiency of digital circuits.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this product suitable for industrial applications with thermal constraints.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable functioning in harsh environmental conditions, making it suitable for outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides excellent corrosion resistance and ensures reliable electrical contact over time.

Terminal Position: DUAL

Dual terminal position allows for easy integration into various circuit layouts and facilitates better connectivity.

Maximum Seated Height: 1.75 mm

Low seating height is ideal for compact designs, helping to maintain a low profile in device assemblies.

Width: 3.9 mm

Compact width is beneficial for high-density PCB layouts and optimal space utilization.

Minimum Supply Voltage (Vsup): 4.5 V

This ensures stable operation in varying power conditions, enhancing the reliability of the device.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for robust soldering processes during manufacturing, ensuring component integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures compatibility with lead-free soldering processes, aligning with modern manufacturing standards.

Length: 8.65 mm

Allows for efficient placement on circuit boards while maintaining the required performance standards.

Temperature Grade: INDUSTRIAL

Industrial-grade components are built for longevity and reliability under demanding conditions, perfect for critical applications.

Technology: TTL

TTL technology offers high speed and robustness, making it an industry standard for digital logic applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joints, enhancing mechanical strength and electrical reliability.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch makes it versatile for various PCB designs and supports efficient routing of signals.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum voltage range of up to 5.5 V allows for flexibility in design, accommodating different power sources.

Maximum Power Supply Current (ICC): 15.3 mA

The low power consumption at maximum current enables energy-efficient designs, critical for battery-operated devices.

Technical Specifications

Logic Gates I74F04D-T attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

15.3 mA

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

I74F04D-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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