Loading...

I74F00D

NXP Semiconductors

I74F00D by NXP Semiconductors

I74F00D from NXP Semiconductors is a TTL logic gate with 4 functions and 2 inputs, designed for industrial applications. It operates at a nominal voltage of 5V, with a propagation delay of just 6.5 ns. This compact surface-mount device features a temperature range of -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,028

-

-

-

-

Anansix

USA . 2,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,807

-

-

-

-

Vyrian

USA . 2,501 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,501

-

-

-

-

Quantum Digital Technology

USA . 2,454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,454

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 8,123 parts In-Stock

1+ parts

$3.790

100+ parts

-

1k+ parts

-

10k+ parts

-

8,123

$3.790

-

-

-

One Stop Electronics

USA . 999 parts In-Stock

1+ parts

$46.000

100+ parts

-

1k+ parts

-

10k+ parts

-

999

$46.000

-

-

-

UNI Independent Distributors

Spain . 6,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,253

-

-

-

-

Kepictronics

USA . 3,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,534

-

-

-

-

S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Corphita

USA . 1,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,762

-

-

-

-

Supply Digital

USA . 1,421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,421

-

-

-

-

Overview

Unlock unparalleled performance in your designs with the I74F00D from NXP Semiconductors. This versatile logic gate delivers exceptional reliability and speed, ensuring seamless integration into a variety of applications—from consumer electronics to industrial automation. With NXP's renowned quality assurance, you can trust that this durable component will enhance efficiency while minimizing power consumption, empowering you to innovate without limits. Elevate your projects with the I74F00D!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for efficient use of board space and simplifies automated assembly.

No. of Functions: 4

With four functions, this logic gate enhances versatility, making it suitable for complex logic operations.

No. of Inputs: 2

Having two inputs allows for straightforward implementation in basic logic circuits.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout options on printed circuit boards (PCBs) for compact designs.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is standard in digital circuits, ensuring compatibility with most systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF helps maintain signal integrity, suitable for various applications.

No. of Terminals: 14

Fourteen terminals provide enough connections for multiple functionalities while remaining compact.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to efficient space utilization in electronic designs.

Propagation Delay (tpd): 6.5 ns

A propagation delay of 6.5 ns ensures fast signal processing, which is crucial for high-speed applications.

Maximum Operating Temperature: 85 °C

An operational temperature of up to 85 °C makes this product suitable for a wide range of industrial applications.

Minimum Operating Temperature: -40 °C

A minimum temperature rating of -40 °C allows for reliable performance in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish ensures excellent conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positioning allows for flexible connectivity options on PCBs.

Maximum Seated Height: 1.75 mm

A low seated height allows for slim designs, contributing to compact and lightweight product solutions.

Width: 3.9 mm

A width of 3.9 mm aids in compact circuit designs, making it ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V offers flexibility in power supply options for designers.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow temperature time of 30 seconds minimizes the risk of thermal damage during soldering.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C is standard for modern soldering processes, ensuring reliability.

Length: 8.65 mm

An 8.65 mm length makes this device suitable for a variety of PCB layouts without cluttering.

Temperature Grade: INDUSTRIAL

Being graded for industrial use guarantees robustness and reliability in demanding environments.

Technology: TTL

The use of TTL technology allows for high-speed and reliable switching, essential for digital circuits.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering, optimizing assembly processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides an ideal balance between compactness and ease of soldering.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for a wide range of compatible power supplies.

Maximum Power Supply Current (ICC): 10.2 mA

A maximum current of 10.2 mA enables efficient operation with manageable power consumption.

Technical Specifications

Logic Gates I74F00D attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

10.2 mA

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

I74F00D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20