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I74F04N

NXP Semiconductors

I74F04N by NXP Semiconductors

I74F04N from NXP Semiconductors is a TTL logic gate with a propagation delay of 8 ns, operating at a nominal voltage of 5V. It features 6 functions and supports industrial applications with a max temp of 85 °C. Ideal for compact designs, it has a dual terminal form factor.

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Anansix

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AZTECH Wire

Italy . 8,342 parts In-Stock

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One Stop Electronics

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Corphita

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Supply Digital

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Overview

Unlock unparalleled performance with the I74F04N from NXP Semiconductors, a leading name in high-quality logic gate solutions. Engineered for efficiency and reliability, this versatile component excels in diverse applications, from automotive to industrial systems. Experience swift response times and durable performance under extreme conditions, ensuring your projects thrive. Trust NXP for innovative technology that delivers exceptional value and enhances your design capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 8 ns

With a fast propagation delay of 8 ns, this logic gate ensures quick signal processing, which is essential for high-speed applications.

No. of Functions: 6

Having 6 functions allows for versatile logic operations, making this product ideal for complex circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on printed circuit boards, facilitating compact designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V ensures compatibility with a wide range of digital circuits and systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for better signal integrity, making it suitable for driving other logic gate inputs.

Power Supplies (V): 5

Standard power supply voltage of 5V means easy integration into common electronic systems and reduces complexity.

No. of Terminals: 14

Having 14 terminals provides flexibility in circuit designs and allows for more connections in integrated systems.

Package Style (Meter): IN-LINE

The in-line package style facilitates easier layout on PCBs and simplifies assembly processes.

Maximum I (ol): 20 Amp

A high output current capability of 20 Amp allows the logic gate to drive significant loads, making it versatile for various applications.

Propagation Delay (tpd): 8 ns

Consistent propagation delay of 8 ns ensures predictable timing in digital circuits, critical for synchronous operations.

Maximum Operating Temperature: 85 °C

Rated for operation up to 85 °C, this component is suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Capable of functioning at -40 °C makes it ideal for harsh environments and ensures reliable performance in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and reduces oxidation, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for flexible board layout, accommodating various design requirements.

Maximum Seated Height: 4.2 mm

A low seated height of 4.2 mm enables integration into slimmer designs without compromising performance.

Width: 7.62 mm

The compact width makes it suitable for dense layouts, optimizing space utilization on PCBs.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V allows flexibility in power supply options, making it adaptable for various applications.

Length: 19.025 mm

The precise length ensures a perfect fit in standard sockets, promoting ease of installation and reliability.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is designed for reliability and robustness in demanding environments.

Technology: TTL

Using TTL technology provides high speed and reliability, which is essential for performing complex logic functions efficiently.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, making it suitable for high-vibration environments.

Terminal Pitch: 2.54 mm

The standard 2.54 mm terminal pitch ensures compatibility with most board designs and facilitates easy placement and soldering.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides a safety margin, enhancing reliability in power supply variations.

Maximum Power Supply Current (ICC): 15.3 mA

With a maximum power supply current of 15.3 mA, this logic gate is energy-efficient, reducing overall power consumption in the circuit.

Technical Specifications

Logic Gates I74F04N attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

15.3 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

I74F04N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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