Loading...

HEF40097BPB

NXP Semiconductors

HEF40097BPB by NXP Semiconductors

HEF40097BPB by NXP is a CMOS bus driver with 2 functions and operates b/w 3V to 15V. It features a propagation delay of 140 ns, supports up to 50 pF load capacitance, and has a military temperature grade (-55 °C to +125 °C). Ideal for reliable data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,305

-

-

-

-

Anansix

USA . 1,402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,402

-

-

-

-

Digiode

USA . 173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

173

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,618 parts In-Stock

1+ parts

$21.120

100+ parts

-

1k+ parts

$14.786

10k+ parts

$14.786

5,618

$21.120

-

$14.786

$14.786

One Stop Electronics

USA . 376 parts In-Stock

1+ parts

$38.000

100+ parts

-

1k+ parts

-

10k+ parts

-

376

$38.000

-

-

-

Corphita

USA . 4,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,800

-

-

-

-

UNI Independent Distributors

Spain . 3,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,699

-

-

-

-

Northwest PG Solutions

USA . 579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

579

-

-

-

-

Native Components

USA . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

96

-

-

-

-

Overview

Unlock seamless data communication with the HEF40097BPB by NXP Semiconductors. Renowned for their reliability, NXP delivers a bus driver that excels in performance and efficiency. Perfect for industrial, automotive, and consumer applications, this device ensures smooth signal transmission across multiple ports. With exceptional temperature resilience and robust design, it empowers engineers to create cutting-edge solutions that stand the test of time. Elevate your projects with proven quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides a balance of durability and light weight, making the product suitable for various applications.

No. of Functions: 2

With two functions, this product can handle multiple operations, enhancing its versatility for different circuit designs.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient PCB layout and space management, allowing for easier integration into compact systems.

No. of Bits: 4

Having 4 bits enables the transceiver to transmit and receive data in a compact manner, accommodating small data packets effectively.

Nominal Supply Voltage / Vsup: 5 V

The nominal supply voltage of 5 V is common in digital circuits, ensuring compatibility and ease of integration into standard systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF optimizes signal integrity and speed, making this driver efficient for high-frequency applications.

No. of Terminals: 16

With 16 terminals, this product offers ample connectivity for various input and output configurations, enhancing system integration.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to mount on PCBs and simplifies routing for signal connections.

Propagation Delay (tpd): 140 ns

A propagation delay of 140 ns ensures fast switching times, suitable for applications that require quick response and data transfer.

Maximum Operating Temperature: 125 °C

The ability to operate at a maximum temperature of 125 °C makes this product suitable for high-temperature environments.

Output Characteristics: 3-STATE

3-state output characteristics provide flexibility in bus systems, allowing for efficient communication and control of multiple devices.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55 °C ensures reliable performance in extreme cold environments, ideal for military and aerospace applications.

Terminal Position: DUAL

The dual terminal position allows for improved layout options on PCBs, offering versatility in design.

No. of Ports: 2

With two ports, this product supports multiple connections and enhances data flow through parallel processing.

Maximum Seated Height: 4.7 mm

The compact seated height of 4.7 mm is advantageous for low-profile designs, saving space on PCBs.

Width: 7.62 mm

At 7.62 mm wide, this product can fit into tight spaces while allowing for adequate airflow and heat dissipation.

Output Polarity: TRUE

True output polarity provides straightforward signal outputs, improving the clarity of data transmission.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3 V, this product is adaptable to various power environments, increasing its application range.

Length: 21.6 mm

The length of 21.6 mm allows for easy mounting and integration into most standard PCB layouts.

Temperature Grade: MILITARY

The military grade ensures that this product can withstand extreme conditions and is built for reliability in critical applications.

Technology: CMOS

CMOS technology is known for low power consumption and high noise immunity, making this device energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures robust mechanical connections, making the product suitable for environments with vibrations.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch standardizes the connection interface, facilitating easier integration with various PCB designs.

Maximum Supply Voltage (Vsup): 15 V

The capability to handle a maximum supply voltage of 15 V expands the operational envelope, allowing use in diverse applications.

Technical Specifications

Bus Driver & Transceivers HEF40097BPB attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

Length:

21.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

140 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF40097BPB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19