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HEF40098BDB

NXP Semiconductors

HEF40098BDB by NXP Semiconductors

HEF40098BDB by NXP is a 6-bit CMOS bus driver with a 3-state output, ideal for industrial applications. It operates b/w -40 °C to 85 °C and supports supply voltages from 3V to 15V. With a propagation delay of just 160 ns, it ensures efficient data transmission.

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1k+

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Vyrian

USA . 4,797 parts In-Stock

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Digiode

USA . 3,402 parts In-Stock

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Anansix

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Native Components

USA . 326 parts In-Stock

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$0.984

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Northwest PG Solutions

USA . 451 parts In-Stock

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Andel Nordic

Denmark . 5,866 parts In-Stock

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One Stop Electronics

USA . 1,640 parts In-Stock

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$49.000

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Corphita

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UNI Independent Distributors

Spain . 279 parts In-Stock

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Overview

Experience unparalleled performance with the HEF40098BDB from NXP Semiconductors, a leader in high-quality semiconductor solutions. This advanced bus driver and transceiver excels in industrial applications, delivering reliable data transfer with exceptionally low propagation delay. Crafted with precision, its robust ceramic and glass-sealed packaging ensures durability even in challenging environments. Elevate your designs with NXP's trusted technology for unmatched value and efficiency!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package ensures high durability and resistance to environmental factors, making it suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and easy integration into various circuit designs.

No. of Bits: 6

With 6 bits, this bus driver can effectively handle medium-size data transfers, suitable for a variety of applications.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5V ensures compatibility with standard digital logic levels, enhancing integration with existing systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for better signal integrity and performance in signal transmission over short distances.

No. of Terminals: 16

Having 16 terminals provides versatility in design, enabling multiple connections in a compact layout.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy positioning on PCBs and can help reduce routing complexity.

Propagation Delay (tpd): 160 ns

With a propagation delay of 160 ns, this product ensures quick data transitions, making it suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in high-temperature environments, enhancing the lifespan of the device.

Output Characteristics: 3-STATE

3-state output characteristics allow for flexible bus control, enabling shared data lines in multi-device setups.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C means the product is suitable for harsh environments and industrial applications.

Terminal Position: DUAL

Dual terminal positioning provides layout flexibility and can improve soldering efficiency on PCBs.

No. of Ports: 2

Having 2 ports allows for bi-directional data transmission, improving the versatility of applications.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm ensures compatibility with standard PCB manufacturing practices.

Width: 7.62 mm

With a width of 7.62 mm, this product can easily fit into various PCB layouts without additional modifications.

Output Polarity: INVERTED

The inverted output polarity is useful for certain applications where signal inversion is necessary, providing design flexibility.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, this device can operate in low-voltage applications, enhancing energy efficiency.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in challenging conditions, ideal for industrial use.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this device energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical support and is suitable for prototypes and robust applications.

Terminal Pitch: 2.54 mm

A 2.54 mm terminal pitch is standard in many applications, making it easy to integrate with existing components.

Maximum Supply Voltage (Vsup): 15 V

The capability to operate up to 15V allows for flexibility in various circuit designs and power supply configurations.

Technical Specifications

Bus Driver & Transceivers HEF40098BDB attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T16

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF40098BDB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-12-314-0934, 5962123140934

NIIN

123140934

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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