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HEF40097BDB

NXP Semiconductors

HEF40097BDB by NXP Semiconductors

HEF40097BDB by NXP Semiconductors is a CMOS bus driver featuring 2 functions and operates at a nominal voltage of 5V. It supports 3-state output with a propagation delay of 140 ns, ideal for military applications. Its robust design withstands temperatures from -55 °C to 125 °C.

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4

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1k+

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Vyrian

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Digiode

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Anansix

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ComSIT Distribution GmbH

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One Stop Electronics

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Andel Nordic

Denmark . 3,297 parts In-Stock

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UNI Independent Distributors

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Corphita

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Northwest PG Solutions

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Overview

Elevate your designs with the HEF40097BDB from NXP Semiconductors, where quality meets reliability. Engineered for demanding applications, this robust bus driver and transceiver excels in high-performance environments. With a military-grade temperature range and superior ceramic construction, it ensures durability in critical systems. Experience seamless data transmission and enhanced control, making it your go-to solution for reliable connectivity in any project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package provides excellent durability and protection against environmental factors, ensuring long-term reliability in harsh conditions.

No. of Functions: 2

With dual functions integrated into one chip, this product offers space and cost efficiency while allowing for more complex designs.

Package Shape: RECTANGULAR

The rectangular package shape enhances the ease of PCB layout and optimization of space in electronic designs.

No. of Bits: 4

Supporting 4 bits allows for efficient data handling and processing, making it suitable for a variety of communication applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V ensures compatibility with a wide range of systems and reduces design complexities.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF enables stable performance and minimizes signal degradation, essential for reliable signal integrity.

No. of Terminals: 16

Having 16 terminals provides flexibility in circuit design, allowing for numerous connection possibilities and versatile applications.

Package Style (Meter): IN-LINE

The in-line package style simplifies assembly and integrates seamlessly into various PCB layouts for efficient design.

Propagation Delay (tpd): 140 ns

With a propagation delay of only 140 ns, this product ensures quick signal transmission, crucial for high-performance applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C makes this product suitable for high-temperature environments, ensuring reliable performance.

Output Characteristics: 3-STATE

The 3-state output allows multiple devices to share the same bus, improving design efficiency by reducing the number of required components.

Minimum Operating Temperature: -55 °C

A wide operating temperature range down to -55 °C makes this device suitable for extreme environments, such as military and aerospace applications.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options, enhancing adaptability in various circuit designs.

No. of Ports: 2

Having 2 ports allows for multiple connections, enabling efficient communication in multi-device systems.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm allows for compact designs while ensuring stable and secure placement on the PCB.

Width: 7.62 mm

The compact width of 7.62 mm promotes a smaller footprint on PCBs, making it ideal for space-constrained applications.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, increasing reliability in signal processing applications.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3V enhances adaptability to various power supply configurations, making it suitable for diverse applications.

Temperature Grade: MILITARY

Rated for military temperature grade ensures high reliability and performance in demanding and variable environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high-speed operation, making this product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical stability and makes it suitable for a wide range of mounting requirements.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard for many PCB designs, ensuring easy integration into existing layouts and designs.

Maximum Supply Voltage (Vsup): 15 V

A high maximum supply voltage of 15 V provides flexibility in applications requiring higher power levels or greater voltage swings.

Technical Specifications

Bus Driver & Transceivers HEF40097BDB attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T16

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

140 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF40097BDB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-12-314-0933, 5962123140933

NIIN

123140933

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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