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HEF40098BP,652

NXP Semiconductors

HEF40098BP,652 by NXP Semiconductors

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$1.010

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 223 parts In-Stock

1+ parts

$1.010

100+ parts

$0.990

1k+ parts

$0.970

10k+ parts

-

223

$1.010

$0.990

$0.970

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,574 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

1,574

$0.960

-

-

-

Chip Stock

USA . 83,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

83,000

-

-

-

-

Vyrian

USA . 6,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,748

-

-

-

-

Anansix

USA . 604 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

604

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,454 parts In-Stock

1+ parts

$0.909

100+ parts

-

1k+ parts

-

10k+ parts

-

2,454

$0.909

-

-

-

AZTECH Wire

Italy . 1,201 parts In-Stock

1+ parts

$9.990

100+ parts

-

1k+ parts

-

10k+ parts

-

1,201

$9.990

-

-

-

Andel Nordic

Denmark . 1,523 parts In-Stock

1+ parts

$16.070

100+ parts

-

1k+ parts

$11.252

10k+ parts

$11.252

1,523

$16.070

-

$11.252

$11.252

Native Components

USA . 363 parts In-Stock

1+ parts

$289.720

100+ parts

$283.926

1k+ parts

$281.028

10k+ parts

$278.131

363

$289.720

$283.926

$281.028

$278.131

Northwest PG Solutions

USA . 1,025 parts In-Stock

1+ parts

$318.692

100+ parts

-

1k+ parts

-

10k+ parts

-

1,025

$318.692

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,827 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,827

-

-

-

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UNI Independent Distributors

Spain . 7,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,587

-

-

-

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Microchip USA

USA . 3,522 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,522

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-

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Perfect Parts

USA . 2,240 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,240

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Technical Specifications

Bus Driver & Transceivers HEF40098BP,652 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Control Type:

ENABLE LOW

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

21.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

BULK

Maximum Power Supply Current (ICC):

120 mA

Propagation Delay At Nominal Supply:

160 ns

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF40098BP,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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