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HEF40098BPN

NXP Semiconductors

HEF40098BPN by NXP Semiconductors

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,400

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-

-

-

Digiode

USA . 2,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,214

-

-

-

-

Anansix

USA . 1,112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,112

-

-

-

-

LIBRA Elektronik GmbH

Germany . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,501 parts In-Stock

1+ parts

$3.715

100+ parts

-

1k+ parts

$3.566

10k+ parts

$3.566

4,501

$3.715

-

$3.566

$3.566

One Stop Electronics

USA . 614 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

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614

$29.000

-

-

-

UNI Independent Distributors

Spain . 7,184 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,184

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-

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Northwest PG Solutions

USA . 1,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.943

10k+ parts

-

1,405

-

-

$3.943

-

Native Components

USA . 838 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.902

10k+ parts

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838

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-

$3.902

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Corphita

USA . 691 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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691

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Technical Specifications

Bus Driver & Transceivers HEF40098BPN attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Control Type:

ENABLE LOW

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

Length:

21.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

BULK

Peak Reflow Temperature (C):

245

Maximum Power Supply Current (ICC):

120 mA

Propagation Delay At Nominal Supply:

160 ns

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

HEF40098BPN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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