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BLF7G22L-130N

NXP Semiconductors

BLF7G22L-130N by NXP Semiconductors

BLF7G22L-130N by NXP Semiconductors is an N-channel RF power FET designed for amplifier applications. It features a 65V min breakdown voltage, 28A max drain current, and operates in the S band. This ceramic, metal-sealed transistor is ideal for high-frequency enhancements.

Median Price

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Lifecycle Status

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4

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1k+

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Digiode

USA . 3,643 parts In-Stock

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Vyrian

USA . 1,341 parts In-Stock

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Anansix

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Cyclops Electronics Ltd

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Native Components

USA . 52 parts In-Stock

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Northwest PG Solutions

USA . 1,626 parts In-Stock

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One Stop Electronics

USA . 1,153 parts In-Stock

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$40.050

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A-Z Elektronik GmbH

Germany . 6,935 parts In-Stock

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Assy Fe

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Alle Elektronik GmbH

Germany . 4,623 parts In-Stock

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Kepictronics

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Corphita

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UNI Independent Distributors

Spain . 3,862 parts In-Stock

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Authorized Procurement Solutions

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Overview

Unlock unparalleled performance in your RF applications with the BLF7G22L-130N from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers this powerful N-channel FET, designed to amplify signals with exceptional efficiency. Perfect for S-band operations, it ensures reliable performance in demanding environments, providing you with the advantage of durability and high output. Elevate your projects and experience superior signal integrity today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package provide excellent thermal performance and reliability, making it suitable for high-power applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and faster switching speeds, making this transistor ideal for amplifier applications.

Configuration: SINGLE

A single configuration minimizes complexity and allows for easier integration into circuit designs, simplifying production processes.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor is optimized for performance, making it ideal for RF applications.

Surface Mount: YES

Surface mount technology (SMT) allows for compact designs and automated manufacturing processes, enabling smaller form factor products.

Minimum DS Breakdown Voltage: 65 V

A high breakdown voltage ensures robustness and reliability in demanding applications, allowing it to handle extreme voltage conditions.

Package Shape: RECTANGULAR

Rectangular package shapes promote efficient use of PCB space, allowing for better layout options in designs.

Terminal Form: FLAT

Flat terminals facilitate a robust connection to the PCB and enable better thermal conductivity, enhancing overall performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides lower quiescent current and enables a wider range of applications, making it more versatile.

Highest Frequency Band: S BAND

The capability to operate in the S band makes it suitable for various communication and radar applications, enhancing its usability.

No. of Terminals: 2

A simple 2-terminal design reduces circuit complexity while maintaining essential functionality, making it easy to integrate into existing systems.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure mounting in harsh environments, providing durability and stability in application settings.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high efficiency and fast switching capabilities, making it suitable for both analog and digital applications.

Transistor Element Material: SILICON

Silicon is a well-established material known for its excellent electrical properties, ensuring reliability and performance.

Maximum Drain Current (ID): 28 A

A maximum drain current of 28 A indicates strong performance in high-current applications, making it ideal for robust designs.

Terminal Position: DUAL

Dual terminal positions enhance flexibility in PCB layout, allowing for easier connections and improved thermal management.

Case Connection: SOURCE

Connecting the source to the case improves heat dissipation, ensuring stable operation even under high load conditions.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF7G22L-130N attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (ID):

28 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-CDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF7G22L-130N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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