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BLF7G10L-250

NXP Semiconductors

BLF7G10L-250 by NXP Semiconductors

BLF7G10L-250 by NXP Semiconductors is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 56 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. Its ceramic, metal-sealed package ensures durability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,774 parts In-Stock

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Digiode

USA . 3,716 parts In-Stock

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Anansix

USA . 2,088 parts In-Stock

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Native Components

USA . 619 parts In-Stock

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$0.224

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$0.215

619

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Northwest PG Solutions

USA . 2,226 parts In-Stock

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$0.246

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$0.217

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One Stop Electronics

USA . 435 parts In-Stock

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$16.050

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435

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Corphita

USA . 3,134 parts In-Stock

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UNI Independent Distributors

Spain . 2,955 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 258 parts In-Stock

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Overview

Unlock powerful performance with the BLF7G10L-250 from NXP Semiconductors, a leader in innovative RF solutions. This high-quality N-channel FET transforms your amplification needs, delivering exceptional efficiency and reliability for ultra-high frequency applications. Its robust ceramic and metal-sealed design ensures durability while minimizing signal loss. Elevate your projects with this versatile component that promises precision, longevity, and unmatched value, setting the standard in RF technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable material provides excellent thermal stability and reliability, making it suitable for high-performance applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, leading to improved efficiency and performance in amplification applications.

Configuration: SINGLE

A single configuration allows for straightforward integration into circuits, reducing complexity and enhancing usability.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is ideal for use in a variety of audio and RF applications, ensuring high fidelity and performance.

Surface Mount: YES

Surface mount technology enables compact design and easier assembly in modern electronic devices, essential for space-constrained applications.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65V provides a robust operating range, offering reliable performance in high-voltage environments.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout design and reliable mounting options in various circuit configurations.

Terminal Form: FLAT

Flat terminals allow for excellent electrical contact and thermal performance, ensuring stable operation and lower resistance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation is ideal for applications requiring high input impedance, making this FET suitable for sensitive circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed to operate in the ultra high frequency band, this transistor can handle high-frequency signals effectively, perfect for RF applications.

No. of Terminals: 2

A two-terminal configuration simplifies connections, reducing potential points of failure and aiding in compact circuit design.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers robust mechanical stability and ease of installation, making it a reliable choice for various assemblies.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high scalability and efficiency, which is essential for modern electronic applications.

Transistor Element Material: SILICON

Silicon is a standard semiconductor material that ensures reliable performance and cost-effectiveness, widely understood in the industry.

Maximum Drain Current (ID): 56 A

A maximum drain current of 56A supports high-power applications, enabling this FET to handle demanding performance requirements.

Terminal Position: DUAL

Dual terminal positioning allows for versatile layout options, enhancing design flexibility in various electronic circuits.

Case Connection: SOURCE

Direct connection to the source facilitates efficient current flow and enhances the overall performance of the circuit.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF7G10L-250 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (ID):

56 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F2

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF7G10L-250 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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