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BB133

NXP Semiconductors

BB133 by NXP Semiconductors

VARIABLE CAPACITANCE DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

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In-Stock Inventory

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NAC Semi

USA . 2,989 parts In-Stock

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Mil-Aero Solutions, Inc.

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ComSIT Distribution GmbH

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GES GmbH

Germany . 2,448 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

USA . 1,402 parts In-Stock

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Digiode

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Corel Iberica Componentes, S.L.

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Vyrian

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Cogito LLC

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ECAB

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Anansix

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Prism Electronics

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One Stop Electronics

USA . 1,108 parts In-Stock

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Assy Fe

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Authorized Procurement Solutions

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Metaverse IC Inc.

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Glotronic Ltd.

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A-Z Elektronik GmbH

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UNI Independent Distributors

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Corphita

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Northwest PG Solutions

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Native Components

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Technical Specifications

Varactor Diodes BB133 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Additional Features:

0.7% MATCHED SETS OF 4 DIODES AND 2% MATCHED SETS OF 15 DIODES ARE AVAILABLE

Minimum Breakdown Voltage:

30 V

Config:

SINGLE

Diode Cap Tolerance:

9.52 %

Minimum Diode Capacitance Ratio:

14

Nominal Diode Capacitance:

42 pF

Diode Element Material:

SILICON

Frequency Band:

VERY HIGH FREQUENCY

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

30 V

Maximum Reverse Current:

.01 uA

Reverse Test Voltage:

30 V

Sub-Category:

Varactors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Trade Compliance

BB133 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

NSN

3110-01-310-0872, 3110013100872, 6910-66-028-8383, 6910660288383

NIIN

013100872, 660288383

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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