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BB131,115

NXP Semiconductors

BB131,115 by NXP Semiconductors

VARIABLE CAPACITANCE DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

$0.124

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 47 parts In-Stock

1+ parts

$0.103

100+ parts

$0.099

1k+ parts

-

10k+ parts

-

47

$0.103

$0.099

-

-

DigiKey

USA . 2,568 parts In-Stock

1+ parts

$0.500

100+ parts

$0.195

1k+ parts

$0.131

10k+ parts

-

2,568

$0.500

$0.195

$0.131

-

Flip Electronics (Authorized)

USA . 547,000 parts In-Stock

1+ parts

-

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547,000

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-

-

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Chip1Stop

Japan . 12,937 parts In-Stock

1+ parts

-

100+ parts

$0.105

1k+ parts

-

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12,937

-

$0.105

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-

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.124

1k+ parts

$0.103

10k+ parts

$0.091

6,000

-

$0.124

$0.103

$0.091

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.154

6,000

-

-

-

$0.154

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,059 parts In-Stock

1+ parts

$0.093

100+ parts

-

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-

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3,059

$0.093

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-

-

Digiode

USA . 1,204 parts In-Stock

1+ parts

$0.096

100+ parts

-

1k+ parts

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10k+ parts

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1,204

$0.096

-

-

-

Component Electronics Inc.

Canada . 6,000 parts In-Stock

1+ parts

$0.380

100+ parts

$0.290

1k+ parts

$0.250

10k+ parts

-

6,000

$0.380

$0.290

$0.250

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Flip Electronics

USA . 529,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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529,000

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-

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Sensible Micro Corp

USA . 18,000 parts In-Stock

1+ parts

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18,000

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-

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DigiKey Marketplace

USA . 12,000 parts In-Stock

1+ parts

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100+ parts

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12,000

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-

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Anansix

USA . 2,596 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,596

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,307 parts In-Stock

1+ parts

$0.091

100+ parts

-

1k+ parts

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10k+ parts

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4,307

$0.091

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Perfect Parts

USA . 88,241 parts In-Stock

1+ parts

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88,241

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UNI Independent Distributors

Spain . 5,195 parts In-Stock

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5,195

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-

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Northwest PG Solutions

USA . 2,090 parts In-Stock

1+ parts

-

100+ parts

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2,090

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-

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Native Components

USA . 878 parts In-Stock

1+ parts

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878

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Microchip USA

USA . 408 parts In-Stock

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408

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Technical Specifications

Varactor Diodes BB131,115 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Minimum Breakdown Voltage:

30 V

Config:

SINGLE

Diode Cap Tolerance:

36 %

Minimum Diode Capacitance Ratio:

12

Nominal Diode Capacitance:

12.5 pF

Diode Element Material:

SILICON

Frequency Band:

VERY HIGH FREQUENCY

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

30 V

Maximum Reverse Current:

.01 uA

Reverse Test Voltage:

30 V

Sub-Category:

Varactors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BB131,115 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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