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74LVTH16374ABX,518

NXP Semiconductors

74LVTH16374ABX,518 by NXP Semiconductors

74LVTH16374ABX,518 by NXP Semiconductors is a CMOS latch with a 5 ns propagation delay and operates at 3.3V. It features 16 functions, supports surface mount, and handles up to 64A output current. Ideal for high-speed digital applications in industrial environments.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 68,000 parts In-Stock

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Vyrian

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Anansix

USA . 2,870 parts In-Stock

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Digiode

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Northwest PG Solutions

USA . 1,387 parts In-Stock

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One Stop Electronics

USA . 1,037 parts In-Stock

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AZTECH Wire

Italy . 1,049 parts In-Stock

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UNI Independent Distributors

Spain . 6,277 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,997 parts In-Stock

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Corphita

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Microchip USA

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Native Components

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Overview

Unlock unmatched performance with the 74LVTH16374ABX,518 from NXP Semiconductors, a trusted leader in innovation. This state-of-the-art latch delivers exceptional speed and reliability, perfect for high-speed applications ranging from telecommunications to automotive systems. Enjoy improved power efficiency and robust design that withstands extreme conditions, ensuring your projects achieve new heights of excellence. Choose quality, choose NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 5 ns

A low propagation delay of 5 ns enables high-speed switching, enhancing performance in fast operations.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern PCB layouts.

No. of Functions: 16

With 16 functions, this device offers versatility, enabling the handling of multiple tasks within a single chip.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with most digital circuits while reducing power consumption.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for reliable performance in various applications, contributing to signal integrity.

Power Supplies (V): 3.3

The requirement of 3.3V for power supplies simplifies design and reduces the complexity of power management.

No. of Terminals: 60

With 60 terminals, the product provides a wide range of connectivity options for complex applications.

Maximum I (ol): 64 Amp

A maximum output current of 64 Amp allows for driving high-current loads directly from the device without additional components.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this product suitable for industrial applications with temperature challenges.

Output Characteristics: 3-STATE

3-state output characteristics provide flexibility in controlling signal lines, aiding in effective bus communication.

Trigger Type: POSITIVE EDGE

The positive edge trigger mechanism ensures reliable and predictable response timing, essential for synchronous systems.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for harsh environments and extreme conditions.

Maximum Time At Peak Reflow Temperature (s): 30

Limiting peak reflow exposure to 30 seconds helps ensure component integrity during manufacturing processes.

Peak Reflow Temperature °C: 260

Supporting a peak reflow temperature of 260 °C allows for compatibility with lead-free soldering processes.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates suitability for demanding applications requiring reliability over a wide temperature range.

Maximum Frequency At Nominal Supply: 150000000 Hz

The ability to operate at a maximum frequency of 150 MHz allows for high-speed data processing and communication.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates moderate sensitivity to moisture, suggesting proper handling and storage to maintain reliability.

Technical Specifications

Latches & Flip-Flops 74LVTH16374ABX,518 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

16

No. of Terminals:

60

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SLGA60,8X12,20

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Trade Compliance

74LVTH16374ABX,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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