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74ALVCH16841DGG:11

NXP Semiconductors

74ALVCH16841DGG:11 by NXP Semiconductors

D LATCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$1.632

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,511 parts In-Stock

1+ parts

-

100+ parts

$1.600

1k+ parts

$1.330

10k+ parts

$1.180

4,511

-

$1.600

$1.330

$1.180

Verical

USA . 2,436 parts In-Stock

1+ parts

-

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-

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$1.663

10k+ parts

$1.475

2,436

-

-

$1.663

$1.475

Distributors (In-Stock)

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Digiode

USA . 4,602 parts In-Stock

1+ parts

$0.638

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4,602

$0.638

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Chip Stock

USA . 59,000 parts In-Stock

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59,000

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Vyrian

USA . 6,604 parts In-Stock

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Anansix

USA . 1,062 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 714 parts In-Stock

1+ parts

$0.469

100+ parts

-

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$0.450

714

$0.469

-

-

$0.450

Northwest PG Solutions

USA . 1,615 parts In-Stock

1+ parts

$0.516

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$0.455

1,615

$0.516

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$0.455

Corphita

USA . 4,086 parts In-Stock

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$0.605

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4,086

$0.605

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AZTECH Wire

Italy . 1,107 parts In-Stock

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$15.830

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1,107

$15.830

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QUARKTWIN TECHNOLOGY LTD

USA . 11,603 parts In-Stock

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UNI Independent Distributors

Spain . 7,662 parts In-Stock

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Microchip USA

USA . 4,766 parts In-Stock

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Continental Prestige Electronics

USA . 3,281 parts In-Stock

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$0.810

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Perfect Parts

USA . 4 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2 parts In-Stock

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Technical Specifications

Latches & Flip-Flops 74ALVCH16841DGG:11 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G56

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

10

No. of Functions:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.9 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

74ALVCH16841DGG:11 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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