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74AHC1G32GW,165

NXP Semiconductors

74AHC1G32GW,165 by NXP Semiconductors

NXP Semiconductors' 74AHC1G32GW,165 is a CMOS Logic Gate with 2 inputs and 5 terminals. It operates at a supply voltage range of 2-5.5V, offering a propagation delay of 9.5ns and max I (ol) of 8Amp. Ideal for automotive applications due to its small outline package style and wide temperature range from -40 to 125°C.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Chip Stock

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Nova Conductors

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AZTECH Wire

Italy . 364 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 1,463 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality 74AHC1G32GW,165 Logic Gates from NXP Semiconductors. Designed for reliability and performance, this product offers fast propagation delay, low power consumption, and versatile applications in various industries. With a compact design and wide operating temperature range, this Logic Gate is perfect for automotive and other demanding environments. Trust NXP Semiconductors to provide top-notch components that deliver value, efficiency, and innovation to your projects. Elevate your designs with the 74AHC1G32GW,165 Logic Gates today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness.

Propagation Delay At Nominal Supply: 9.5 ns

The fast propagation delay ensures efficient signal processing.

Surface Mount: YES

The surface mount feature makes installation of this product easy and convenient.

No. of Inputs: 2

With two inputs, this logic gate allows for more complex logic operations to be performed.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to fit this logic gate into various circuit designs.

Nominal Supply Voltage / Vsup (V): 5

This standard supply voltage ensures compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

The load capacitance supports reliable performance in various circuit configurations.

Power Supplies (V): 2/5.5

The flexible power supply options make this logic gate versatile in different applications.

No. of Terminals: 5

With five terminals, this logic gate offers connectivity for multiple components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style saves space and allows for dense circuit integration.

Technical Specifications

Logic Gates 74AHC1G32GW,165 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AHC1G32GW,165 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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