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74ABT541DB,112

NXP Semiconductors

74ABT541DB,112 by NXP Semiconductors

NXP Semiconductors' 74ABT541DB,112 is an 8-bit bus driver with a propagation delay of 4.6 ns at 5V supply voltage. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has a max power supply current of 30 mA. Ideal for applications requiring fast signal transmission and control over multiple ports.

Median Price

$0.604

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,914 parts In-Stock

1+ parts

-

100+ parts

$0.593

1k+ parts

$0.492

10k+ parts

$0.439

3,914

-

$0.593

$0.492

$0.439

Verical

USA . 2,298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.615

10k+ parts

$0.548

2,298

-

-

$0.615

$0.548

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,685 parts In-Stock

1+ parts

$0.237

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1,685

$0.237

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Vyrian

USA . 8,795 parts In-Stock

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8,795

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Sensible Micro Corp

USA . 2,249 parts In-Stock

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2,249

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Anansix

USA . 608 parts In-Stock

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608

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Semi Source

USA . 98 parts In-Stock

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98

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Distributors (Availability)

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Corohmni

South Africa . 45 parts In-Stock

1+ parts

$0.222

100+ parts

-

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45

$0.222

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Corphita

USA . 2,675 parts In-Stock

1+ parts

$0.224

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2,675

$0.224

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Component Stockers USA

USA . 4,669 parts In-Stock

1+ parts

$0.250

100+ parts

$0.240

1k+ parts

$0.210

10k+ parts

-

4,669

$0.250

$0.240

$0.210

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Native Components

USA . 396 parts In-Stock

1+ parts

$1.054

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396

$1.054

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Northwest PG Solutions

USA . 813 parts In-Stock

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$1.160

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813

$1.160

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Andel Nordic

Denmark . 3,067 parts In-Stock

1+ parts

$6.132

100+ parts

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1k+ parts

$5.887

10k+ parts

$5.887

3,067

$6.132

-

$5.887

$5.887

Microchip USA

USA . 141 parts In-Stock

1+ parts

$11.450

100+ parts

$11.450

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$11.450

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$11.450

141

$11.450

$11.450

$11.450

$11.450

AZTECH Wire

Italy . 52 parts In-Stock

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$14.740

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52

$14.740

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$18.636

100+ parts

$16.959

1k+ parts

$15.282

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500

$18.636

$16.959

$15.282

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Continental Prestige Electronics

USA . 3,914 parts In-Stock

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$0.300

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3,914

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$0.300

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UNI Independent Distributors

Spain . 3,430 parts In-Stock

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Overview

Unlock seamless communication with the 74ABT541DB,112 from NXP Semiconductors! Designed with top-notch quality and reliability, this bus driver & transceiver is perfect for a wide range of applications. With fast propagation delay and 3-state output characteristics, this product ensures efficient data transmission. Experience the value of high performance and versatility with the 74ABT541DB,112 - your go-to solution for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation, making the product long-lasting and safe to use.

Propagation Delay At Nominal Supply: 4.6 ns

Offers fast signal transmission, ensuring efficient communication in bus driver applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement that is easily accessible and widely compatible.

Output Characteristics: 3-STATE

Enables the bus driver to have multiple output states, providing more flexibility in controlling connected devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments, ensuring stability and performance under harsh conditions.

Terminal Form: GULL WING

Facilitates easy soldering onto circuit boards, simplifying the assembly process.

Technical Specifications

Bus Driver & Transceivers 74ABT541DB,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

4.6 ns

Propagation Delay (tpd):

4.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74ABT541DB,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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