Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYBUTYLENE TEREPHTHALATE; Additional Features: STANDARD: UL94-0; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
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Element14
$36.220
$28.030
$24.010
Farnell
$0.246
Nova Conductors
$0.369
Vyrian
LWI Electronics Inc
ACDS - Activité Composants Distribution Service
Holdelec - ElecDif-Pro
Rebound Electronics
Argo Parts USA
$0.358
Netroflash
Continental Prestige Electronics
$0.445
$0.267
Chip Carrier IC & Component Sockets 2227MC-16-03-09-F1 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Multicomp Pro
Number of Positions or Pins:
Contact Finish - Termination:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
2227MC-16-03-09-F1 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LD1117S33TR
STMicroelectronics
LD1117S33TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It has a small outline package style, operates at an adjustable temperature range from 0 to 125°C, and is ideal for applications requiring stable voltage regulation in compact electronic devices.
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
Dc Components
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
FDN306P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NXP Semiconductors
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LL4148
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
1552200253
Molex
WIRE AND CABLE;
XR2D-2001-N
Omron
IC SOCKET; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
7-1393161-3
TE Connectivity
IC SOCKET; Housing Material: POLYAMIDE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
S421
TE Connectivity's S421 is a chip carrier IC socket with 18 contacts and a PCB contact row spacing of 7.62mm. It has a housing made of glass-filled PBT and can operate in temperatures ranging from -40 to 105 °C. This IC socket is commonly used for solder termination in various electronic applications.
214-3339-00-0602
3m Electronic Products Division
IC SOCKET; Device Type Used On: ZIP14-DIP14; Housing Material: POLYSULFONE AND TORLON; No. of Contacts: 14;
350-90-142-00-001000
Mill-max Mfg
350-90-142-00-001000 by Mill-max Mfg is a Chip Carrier IC Socket with POLYETHYLENE housing material. It features 42 contacts with TIN LEAD (200) mating finish over NICKEL (150). Designed for SIP42 devices, it has RECTANGLE contact configuration and Tin/Lead termination finish for various electronic applications.
DSP2A-PS
Panasonic
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6;
4-1415033-1
IC SOCKET; Termination Type: SOLDER; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 4;
5-1393159-1
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
510-93-168-17-101001
IC SOCKET; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED;
2-345832-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP20; Manufacturer Series: 345832; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e0;
8444-11B1-RK-TP
8444-11B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. It is used on PLCC44 devices and has a min operating temperature of -40°C and max operating temperature of 105°C. The socket has 44 contacts, PHOSPHOR BRONZE contact material, and a bellowed type contact style.
5663
Pomona Electronics
IC SOCKET; Device Type Used On: PLCC52; Manufacturer Series: 5663; No. of Contacts: 52; Additional Features: PLCC SOCKET, 94V-0;
110-83-314-41-801101
Preci-dip Sa
110-83-314-41-801101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated at 1A current. It features a PCB contact row spacing of 7.62mm and housing material made of POLYBUTYLENE TEREPHTHALATE. This socket has a mating contact pitch of 0.1 inch and is suitable for applications requiring reliable connections in electronic devices.
HLT-1712-T-H
Samtec
The Samtec HLT-1712-T-H is a plastic IC socket with 204 brass contacts, featuring Tin over Nickel mating finish. Designed for use on PGA204 devices, it offers reliable connectivity and durability in chip carrier applications.
XR2D-2404
IC SOCKET; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
173-10-316-00-001000
173-10-316-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP16 devices with 16 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
236-6225-00-0602
The 3M Electronic Products Division's 236-6225-00-0602 is a ZIP36 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 36 gold (Au) over nickel (Ni) mating contacts and gold (Au) termination finish. Ideal for chip carrier ICs, this socket ensures reliable connections in electronic applications.
1419106-2
IC SOCKET; Housing Material: NYLON; Contact Material: NOT SPECIFIED; Termination Type: SOLDER; Additional Features: STANDARDS: CSA; UL; Contact Finish (Mating): NOT APPLICABLE;
8484-21B1-RK-TP
The 3M Electronic Products Division's 8484-21B1-RK-TP is a PLCC84 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. It has 84 contacts, matte tin finish over nickel, and operates b/w -40°C to 105°C. Ideal for surface mount applications requiring high insulation resistance and precise terminal pitch of 1.27mm.
110-44-328-41-001000
Mill-max Mfg's 110-44-328-41-001000 is a POLYETHYLENE IC SOCKET for DIP28 devices with 28 contacts. Features MATTE TIN OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
2227MC-08-03-18-F1
Multicomp Pro
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; JESD-609 Code: e4; Additional Features: STANDARD: UL94-0;
2227MC-32-06-06-F1
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYBUTYLENE TEREPHTHALATE; Additional Features: STANDARD: UL94-0; No. of Contacts: 32; Contact Finish (Termination): GOLD;
2227MC-28-03-05-F1
IC SOCKET; Device Type Used On: DIP28; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 28; Contact Finish (Termination): GOLD; Additional Features: STANDARD: UL94-0;
2227MC-24-06-08-F1
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYBUTYLENE TEREPHTHALATE; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Additional Features: STANDARD: UL94-0;
2227MC-18-03-08-F1
IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 18; Contact Finish (Termination): GOLD; Additional Features: STANDARD: UL94-0;
2227MC-28-06-07-F1
IC SOCKET; Device Type Used On: DIP28; Housing Material: POLYBUTYLENE TEREPHTHALATE; JESD-609 Code: e4; Additional Features: STANDARD: UL94-0; No. of Contacts: 28;
2227MC-40-06-05-F1
IC SOCKET; Device Type Used On: DIP40; Housing Material: POLYBUTYLENE TEREPHTHALATE; Contact Finish (Termination): GOLD; Additional Features: STANDARD: UL94-0; JESD-609 Code: e4;
2227MC-14-03-10-F1
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYBUTYLENE TEREPHTHALATE; Contact Finish (Termination): GOLD; Additional Features: STANDARD: UL94-0; No. of Contacts: 14;
2227MC-20-03-07-F1
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 20; Additional Features: STANDARD: UL94-0; Contact Finish (Termination): GOLD;
2227MC-24-03-06-F1
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYBUTYLENE TEREPHTHALATE; Additional Features: STANDARD: UL94-0; JESD-609 Code: e4; No. of Contacts: 24;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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