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2227MC-18-03-08-F1

Multicomp Pro

2227MC-18-03-08-F1 by Multicomp Pro

IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 18; Contact Finish (Termination): GOLD; Additional Features: STANDARD: UL94-0;

Median Price

$0.420

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 8,934 parts In-Stock

1+ parts

$0.258

100+ parts

-

1k+ parts

$0.258

10k+ parts

$0.258

8,934

$0.258

-

$0.258

$0.258

Element14

Singapore . 9,095 parts In-Stock

1+ parts

-

100+ parts

$0.617

1k+ parts

$0.433

10k+ parts

$0.391

9,095

-

$0.617

$0.433

$0.391

Farnell

UK . 8,135 parts In-Stock

1+ parts

-

100+ parts

$0.420

1k+ parts

$0.286

10k+ parts

-

8,135

-

$0.420

$0.286

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Glotronic Ltd.

UK . 2,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,780

-

-

-

-

Technical Specifications

Chip Carrier IC & Component Sockets 2227MC-18-03-08-F1 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Multicomp Pro

Connectivity

Number of Positions or Pins:

18

Contact Finish - Termination:

Gold

Physical Characteristics

IC Socket Type:

JESD-609 Code:

e4

Compatibility

Compatible Device Type:

Additional Features

Special Features:

UL 94V-0

Trade Compliance

2227MC-18-03-08-F1 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

Category top products 20

Authentic purchasing experiences

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