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2227MC-24-06-08-F1

Multicomp Pro

2227MC-24-06-08-F1 by Multicomp Pro

IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYBUTYLENE TEREPHTHALATE; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Additional Features: STANDARD: UL94-0;

Median Price

$0.681

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,201 parts In-Stock

1+ parts

$0.482

100+ parts

$0.416

1k+ parts

-

10k+ parts

-

1,201

$0.482

$0.416

-

-

Element14

Singapore . 389 parts In-Stock

1+ parts

$0.681

100+ parts

$0.514

1k+ parts

$0.441

10k+ parts

-

389

$0.681

$0.514

$0.441

-

Farnell

UK . 389 parts In-Stock

1+ parts

$1.020

100+ parts

$0.613

1k+ parts

$0.489

10k+ parts

-

389

$1.020

$0.613

$0.489

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

LWI Electronics Inc

India . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14

-

-

-

-

Technical Specifications

Chip Carrier IC & Component Sockets 2227MC-24-06-08-F1 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Multicomp Pro

Connectivity

Number of Positions or Pins:

24

Contact Finish - Termination:

Gold

Physical Characteristics

IC Socket Type:

JESD-609 Code:

e4

Compatibility

Compatible Device Type:

Additional Features

Special Features:

UL 94V-0

Trade Compliance

2227MC-24-06-08-F1 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

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Authentic purchasing experiences

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