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2227MC-28-03-05-F1

Multicomp Pro

2227MC-28-03-05-F1 by Multicomp Pro

IC SOCKET; Device Type Used On: DIP28; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 28; Contact Finish (Termination): GOLD; Additional Features: STANDARD: UL94-0;

Median Price

$37.023

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 3,347 parts In-Stock

1+ parts

$0.246

100+ parts

$0.246

1k+ parts

-

10k+ parts

-

3,347

$0.246

$0.246

-

-

Element14

Singapore . 883 parts In-Stock

1+ parts

$73.800

100+ parts

$58.660

1k+ parts

$41.740

10k+ parts

-

883

$73.800

$58.660

$41.740

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chris Electronics

USA . 1,377 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,377

-

-

-

-

Technical Specifications

Chip Carrier IC & Component Sockets 2227MC-28-03-05-F1 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Multicomp Pro

Connectivity

Number of Positions or Pins:

28

Contact Finish - Mating:

TIN

Contact Finish - Termination:

Gold

Physical Characteristics

IC Socket Type:

JESD-609 Code:

e4

Compatibility

Compatible Device Type:

Additional Features

Special Features:

UL 94V-0

Trade Compliance

2227MC-28-03-05-F1 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

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