Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 20; Additional Features: STANDARD: UL94-0; Contact Finish (Termination): GOLD;
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$1.040
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Newark
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$0.636
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$0.580
Element14
$44.990
$34.820
$29.830
Farnell
$0.196
$0.177
Glotronic Ltd.
Chip Carrier IC & Component Sockets 2227MC-20-03-07-F1 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Multicomp Pro
Number of Positions or Pins:
Contact Finish - Termination:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
2227MC-20-03-07-F1 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
1N4148WS
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
Taiwan Semiconductor
1N4148WT
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
North American Philips Discrete Products Div
SS14
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rectron
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Hy Electronic
XR2A-1602
Omron
IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD;
XR2A-2825
IC SOCKET; Manufacturer Series: XR2;
173-10-318-00-001000
Mill-max Mfg
173-10-318-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP18 devices with 18 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
551-10-155-18-121003
Mill-max Mfg's 551-10-155-18-121003 is a PGA155 IC socket with 155 contacts. It features gold (Au) mating finish over nickel (Ni), and gold (Au) termination finish with Ni barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier applications.
P7S-14F
RELAY SOCKET; No. of Contacts: 14;
RSL116091
Amphenol
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Manufacturer Series: RSL; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;
ZA1-20-2-1.00-Z-10
Samtec
IC SOCKET;
24-3508-311
Aries Electronics
Aries Electronics 24-3508-311 is a DIP24 IC socket with 24 contacts, featuring rectangular PCB contact pattern spaced at 7.62mm. It uses wire wrap termination and has a housing made of glass-filled nylon46. Ideal for applications requiring precise connections in electronic circuits.
134-10-328-00-050000
The Mill-max Mfg 134-10-328-00-050000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
8468-21B1-RK-TP
3m Electronic Products Division
8468-21B1-RK-TP by 3M is a PLCC68 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. It has 68 contacts, matte tin finish over nickel, and operates b/w -40°C to 105°C. Ideal for surface mount applications requiring high insulation resistance and reliable connections.
150-80-324-00-018101
Preci-dip Sa
150-80-324-00-018101 by Preci-dip Sa is a DIP24 IC socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing material and BRASS contact material. It has 24 contacts with TIN mating finish and Tin (Sn) termination finish. This IC socket is commonly used for chip carrier applications.
1047028
Phoenix Contact
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
ICF-316-T-O-TR
Samtec's ICF-316-T-O-TR is a chip carrier socket with 16 contacts, rectangular pattern, and liquid crystal polymer housing. It has a contact pitch of 0.1", suitable for DIP16 devices. With operating temperatures from -55°C to 125°C, it is ideal for surface mount applications in electronics.
PTF14A
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Material: NOT SPECIFIED;
ICF-308-T-I-TR
Samtec's ICF-308-T-I-TR is a Chip Carrier IC Socket with 8 contacts, rated at 1A current. It features a rectangular contact pattern on a 7.62mm PCB row spacing, suitable for DIP8 devices. With liquid crystal polymer housing and operating temperatures from -55°C to 125°C, it offers surface mount termination for various applications.
840-AG12D-ES-LF
TE Connectivity
TE Connectivity's 840-AG12D-ES-LF is a Chip Carrier IC Socket with 40 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular pattern, suitable for DIP40 devices. The socket has a PCT plastic polyester housing material and operates b/w -55°C to 105°C, making it ideal for various electronic applications.
M12883/44-01
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; No. of Contacts: 14; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
551-90-022-05-001005
Mill-max Mfg 551-90-022-05-001005 is a PGA22 IC socket with 22 contacts. It features TIN LEAD (200) mating finish and Tin/Lead termination with Nickel barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it's ideal for Chip Carrier applications.
326-93-101-41-003000
Mill-max Mfg's 326-93-101-41-003000 is a PLASTIC IC SOCKET for SIP1 devices. Features GOLD (30) OVER NICKEL (100) contact finish for mating and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets with RECTANGLE contact config.
214-99-318-01-670800
The Mill-max Mfg 214-99-318-01-670800 is a Chip Carrier IC Socket with NYLON46 housing and BERYLLIUM COPPER contacts. It has 18 contacts, TIN LEAD mating finish, and Tin/Lead termination with Nickel barrier. Ideal for DIP18 devices in electronic applications.
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