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TN0604N3-GP002

Microchip Technology

TN0604N3-GP002 by Microchip Technology

TN0604N3-GP002 by Microchip is a N-CHANNEL FET with 40V DS breakdown voltage and 0.7A ID. Ideal for switching applications, it operates in enhancement mode with 0.75 ohm RDS(on) and 50pF Crss. With a max power dissipation of 0.74W, it can withstand temperatures from -55 to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

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Vyrian

USA . 339 parts In-Stock

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339

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Distributors (Availability)

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AZTECH Wire

Italy . 833 parts In-Stock

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$7.823

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833

$7.823

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Ampacity Inc.

Singapore . 1,420 parts In-Stock

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$32.050

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$32.050

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West Coast Incorporated

USA . 6,947 parts In-Stock

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Continental Prestige Electronics

USA . 6,072 parts In-Stock

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6,072

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Argo Parts USA

USA . 2,646 parts In-Stock

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2,646

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Discover the Microchip Technology TN0604N3-GP002, a high-quality Small Signal Field Effect Transistor designed for switching applications. With its N-channel configuration and built-in diode, this transistor offers reliable performance and efficiency. Manufactured by industry leader Microchip Technology, this product delivers exceptional value and benefits to customers seeking enhanced electronic control. Trust in the TN0604N3-GP002 for your next project and experience the advantages of its cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the transistor, making it a reliable choice.

Polarity or Channel Type: N-CHANNEL

The N-channel type allows for efficient switching applications, making this transistor suitable for various electronic devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this transistor simplifies circuit design and enhances its functionality.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high performance and efficiency in controlling electronic circuits.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this transistor can handle high voltage applications, ensuring reliable operation.

Package Shape: ROUND

The round package shape allows for easy installation and compact design, making it ideal for space-constrained applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies soldering and installation, providing a secure connection in electronic circuits.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode offers precise control over the transistor, allowing for improved performance in various applications.

No. of Terminals: 3

Having three terminals offers flexibility in circuit design and allows for versatile integration into electronic systems.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides thermal efficiency and mechanical robustness, ensuring reliable performance in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this transistor offers high speed and low power consumption, making it ideal for digital applications.

Maximum Power Dissipation Ambient: 0.74 W

With a maximum power dissipation of 0.74W, this transistor can handle high power levels without overheating, ensuring reliability in operation.

Maximum Operating Temperature: 150 °C

Operating at a maximum temperature of 150°C ensures stable performance in high-temperature environments.

Transistor Element Material: SILICON

The use of silicon as the transistor element material provides high performance and reliability, making it a durable choice for electronic applications.

Minimum Operating Temperature: -55 °C

Operating at a minimum temperature of -55°C allows for use in extreme cold conditions without compromising performance.

Maximum Drain Current (ID): 0.7 A

With a maximum drain current of 0.7A, this transistor can handle high current loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.75 ohm

The low drain-source on resistance of 0.75 ohms ensures efficient power handling and minimal voltage drop, enhancing overall performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the layout and connection of the transistor in a circuit, making installation easier and more convenient.

Maximum Feedback Capacitance (Crss): 50 pF

The maximum feedback capacitance of 50pF minimizes signal loss and provides stable operation in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) TN0604N3-GP002 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Microchip Technology

Specs

Additional Features:

HIGH INPUT IMPEDANCE

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

.7 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

50 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.74 W

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

TN0604N3-GP002 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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