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TN0604N3-G-P013

Microchip Technology

TN0604N3-G-P013 by Microchip Technology

TN0604N3-G-P013 by Microchip Technology is a N-CHANNEL FET with 40V DS breakdown voltage. Ideal for switching applications, it has a max drain current of 0.7A and a built-in diode. Operating in enhancement mode, it can handle up to 0.74W power dissipation at temperatures ranging from -55°C to 150°C.

Median Price

$1.520

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 37 parts In-Stock

1+ parts

$1.520

100+ parts

$1.410

1k+ parts

$1.140

10k+ parts

-

37

$1.520

$1.410

$1.140

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 139 parts In-Stock

1+ parts

$1.082

100+ parts

-

1k+ parts

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139

$1.082

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Vyrian

USA . 2,487 parts In-Stock

1+ parts

-

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2,487

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 8,262 parts In-Stock

1+ parts

$1.082

100+ parts

-

1k+ parts

-

10k+ parts

$1.060

8,262

$1.082

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-

$1.060

Argo Parts USA

USA . 3,861 parts In-Stock

1+ parts

$1.082

100+ parts

-

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-

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3,861

$1.082

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.082

100+ parts

-

1k+ parts

$1.027

10k+ parts

$1.006

100

$1.082

-

$1.027

$1.006

Ampacity Inc.

Singapore . 20 parts In-Stock

1+ parts

$1.290

100+ parts

-

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-

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20

$1.290

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Component Stockers USA

USA . 480 parts In-Stock

1+ parts

$1.500

100+ parts

$1.130

1k+ parts

-

10k+ parts

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480

$1.500

$1.130

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AZTECH Wire

Italy . 925 parts In-Stock

1+ parts

$16.387

100+ parts

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925

$16.387

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Fulton Briggs Corp.

USA . 1,535 parts In-Stock

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1,535

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Overview

Unleash the power of cutting-edge technology with Microchip Technology's TN0604N3-G-P013 Small Signal Field Effect Transistor! This N-CHANNEL transistor, with its single configuration and built-in diode, is perfect for switching applications. With a minimum DS Breakdown Voltage of 40V and maximum Drain Current of 0.7A, this transistor offers exceptional performance and reliability. Whether you're designing consumer electronics or industrial equipment, this transistor's high-quality construction and enhanced mode operation ensure optimal functionality. Upgrade your projects today with the TN0604N3-G-P013 and experience the difference that Microchip Technology brings to the table!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the transistor, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have better performance and lower resistance compared to P-Channel FETs, making this transistor efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers protection against reverse current flow, enhancing the reliability and lifespan of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast response times and efficient performance.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this transistor can withstand higher voltages, making it suitable for various high-performance applications.

Package Shape: ROUND

The round shape allows for easy integration and mounting in various electronic circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low power consumption, making this transistor ideal for efficient electronic devices.

Technical Specifications

Small Signal Field Effect Transistors (FET) TN0604N3-G-P013 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Microchip Technology

Specs

Additional Features:

HIGH INPUT IMPEDANCE

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

.7 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

50 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.74 W

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

TN0604N3-G-P013 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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