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PIC24EP512GP806T-I/MR

Microchip Technology

PIC24EP512GP806T-I/MR by Microchip Technology

PIC24EP512GP806T-I/MR by Microchip Technology is a 16-bit DSP with 60 MHz clock frequency, 53248 RAM words, and 320 mA max supply current. Ideal for industrial applications, it features 15 DMA channels, FLASH ROM programmability, and low power mode for efficient performance.

Median Price

$11.630

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$11.630

100+ parts

-

1k+ parts

-

10k+ parts

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10

$11.630

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-

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Vyrian

USA . 3,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,540

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$12.354

100+ parts

-

1k+ parts

$11.860

10k+ parts

-

1,000

$12.354

-

$11.860

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Continental Prestige Electronics

USA . 6,640 parts In-Stock

1+ parts

$12.606

100+ parts

-

1k+ parts

-

10k+ parts

$12.354

6,640

$12.606

-

-

$12.354

AZTECH Wire

Italy . 364 parts In-Stock

1+ parts

$17.574

100+ parts

-

1k+ parts

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10k+ parts

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364

$17.574

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Ampacity Inc.

Singapore . 989 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

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10k+ parts

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989

$29.000

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RGB Technical Solutions

Ukraine . 6,203 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,203

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Argo Parts USA

USA . 2,439 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,439

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Overview

Unlock the potential of your digital signal processing projects with the Microchip Technology PIC24EP512GP806T-I/MR. Manufactured by industry leader Microchip Technology, this DSP offers exceptional performance and reliability for a wide range of applications. With its advanced features and capabilities, this product provides unmatched value and benefits to customers seeking high-quality solutions for their projects. Whether you're working on industrial automation, communications systems, or consumer electronics, the PIC24EP512GP806T-I/MR is sure to exceed your expectations and deliver outstanding results. Elevate your designs with this top-of-the-line DSP from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the DSP.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into electronic devices.

Maximum Supply Voltage: 3.6 V

Can operate at a relatively high supply voltage, providing flexibility in power supply options.

On Chip Data RAM Width: 8

Wide on-chip data RAM allows for efficient data processing and storage.

Package Shape: SQUARE

Square package shape helps in efficient PCB layout and space utilization.

Bit Size: 16

16-bit architecture enables high-performance processing capabilities.

No. of Terminals: 64

Having 64 terminals allows for multiple connections and interfaces, expanding the functionality of the DSP.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Varied package styles offer versatility in mounting options and thermal management.

Minimum Supply Voltage: 3 V

Operates at a low minimum supply voltage, ideal for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliability in various environmental conditions.

No. of External Interrupts: 5

Having 5 external interrupts allows for efficient handling of external events and communications.

Minimum Operating Temperature: -40 °C

Can operate at extremely low temperatures, suitable for industrial and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for the terminals.

Terminal Position: QUAD

Quad terminal position offers stable and secure connections on the PCB.

Maximum Seated Height: 1 mm

Low seated height allows for compact designs and space-saving integration.

RAM Words: 53248

Large RAM capacity enables efficient data processing and storage capabilities.

Width: 9 mm

Compact width allows for easy integration into space-constrained devices.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the DSP during production.

Maximum Clock Frequency: 60 MHz

High clock frequency enables fast processing of data and tasks.

Length: 9 mm

Compact length complements the width for space-efficient PCB design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionalities enhances the versatility of the product for various applications.

No. of Timers: 9

Having 9 timers allows for precise timing and control in multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for efficient performance.

Terminal Form: NO LEAD

No-lead terminal form complies with environmental regulations and offers reliability in connections.

Maximum Supply Current: 320 mA

Allows for sufficient current supply to drive the DSP and connected peripherals.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance of the DSP.

No. of DMA Channels: 15

Having 15 DMA channels enables efficient data transfer and processing with minimal CPU intervention.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and customization of the DSP.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact PCB layout.

Format: FLOATING POINT

Floating-point format enables precise and accurate mathematical calculations in DSP operations.

Low Power Mode: YES

Low power mode functionality enhances energy efficiency and extends battery life in portable devices.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 enhances program storage and execution capabilities.

Technical Specifications

Digital Signal Processors (DSPs) PIC24EP512GP806T-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

PIC24EP512GP806T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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