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DSPIC33FJ64GS406-E/PT

Microchip Technology

DSPIC33FJ64GS406-E/PT by Microchip Technology

DSPIC33FJ64GS406-E/PT by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 125°C. Ideal for automotive applications, it features flash ROM programmability, operates at 3.3V with a max supply current of 170mA.

Median Price

$6.910

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 800 parts In-Stock

1+ parts

$6.910

100+ parts

$5.700

1k+ parts

$5.230

10k+ parts

$4.980

800

$6.910

$5.700

$5.230

$4.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 63 parts In-Stock

1+ parts

$6.132

100+ parts

-

1k+ parts

-

10k+ parts

-

63

$6.132

-

-

-

NAC Semi

USA . 640 parts In-Stock

1+ parts

$7.130

100+ parts

$6.470

1k+ parts

$5.910

10k+ parts

-

640

$7.130

$6.470

$5.910

-

Vyrian

USA . 4,127 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,127

-

-

-

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Component Sense

UK . 18 parts In-Stock

1+ parts

-

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 115 parts In-Stock

1+ parts

$5.725

100+ parts

-

1k+ parts

-

10k+ parts

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115

$5.725

-

-

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Semicontronic

India . 1,747 parts In-Stock

1+ parts

$5.870

100+ parts

$5.723

1k+ parts

$5.694

10k+ parts

-

1,747

$5.870

$5.723

$5.694

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Ampacity Inc.

Singapore . 1,663 parts In-Stock

1+ parts

$5.870

100+ parts

-

1k+ parts

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10k+ parts

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1,663

$5.870

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-

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Continental Prestige Electronics

USA . 224 parts In-Stock

1+ parts

$6.132

100+ parts

-

1k+ parts

-

10k+ parts

$6.009

224

$6.132

-

-

$6.009

Bastille Electronics

Australia . 15 parts In-Stock

1+ parts

$6.132

100+ parts

$5.825

1k+ parts

$5.534

10k+ parts

$5.457

15

$6.132

$5.825

$5.534

$5.457

AZTECH Wire

Italy . 778 parts In-Stock

1+ parts

$21.400

100+ parts

-

1k+ parts

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10k+ parts

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778

$21.400

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-

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Lixinc

USA . 19,956 parts In-Stock

1+ parts

-

100+ parts

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19,956

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Fulton Briggs Corp.

USA . 6,228 parts In-Stock

1+ parts

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6,228

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Argo Parts USA

USA . 4,056 parts In-Stock

1+ parts

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4,056

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Overview

Unlock the power of cutting-edge technology with the DSPIC33FJ64GS406-E/PT by Microchip Technology. Designed with precision and reliability in mind, this Digital Signal Processor (DSP) offers unmatched performance in a variety of applications. With a 16-bit architecture, advanced CMOS technology, and flash ROM programmability, this device delivers optimal efficiency and functionality. Whether you're working on automotive projects, controllers, or other digital signal processing tasks, this high-quality product is sure to exceed your expectations. Experience the difference that Microchip Technology brings to the table and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in different applications.

Bit Size: 16

Offers high processing capability for complex algorithms and signal processing tasks.

Power Supplies (V): 3.3

Stable power supply ensures consistent and reliable performance of the DSP.

No. of Terminals: 64

Sufficient number of terminals for connection to various external devices and peripherals.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

Compact package style saves space on the PCB and allows for a higher density of components.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments, suitable for industrial and automotive applications.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the DSP, enabling firmware updates and customization.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving overall efficiency.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64GS406-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Microcontrollers

Maximum Supply Current:

170 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

DSPIC33FJ64GS406-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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