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DSPIC33FJ128GP708A-E/PT

Microchip Technology

DSPIC33FJ128GP708A-E/PT by Microchip Technology

DSPIC33FJ128GP708A-E/PT by Microchip is a 16-bit DSP with 3.3V power supply, operating at up to 40MHz clock frequency. Ideal for automotive applications, it features flash ROM programmability and operates in temperatures ranging from -40°C to 125°C. With a compact square package style and quad terminal position, it offers high performance in a small form factor.

Median Price

$9.620

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 35 parts In-Stock

1+ parts

$9.620

100+ parts

$8.810

1k+ parts

-

10k+ parts

-

35

$9.620

$8.810

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.866

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$7.866

-

-

-

Vyrian

USA . 3,329 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,329

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 936 parts In-Stock

1+ parts

$4.638

100+ parts

-

1k+ parts

$4.452

10k+ parts

$4.452

936

$4.638

-

$4.452

$4.452

Continental Prestige Electronics

USA . 4,963 parts In-Stock

1+ parts

$7.866

100+ parts

-

1k+ parts

-

10k+ parts

$7.709

4,963

$7.866

-

-

$7.709

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.866

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$7.866

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-

-

Ampacity Inc.

Singapore . 110 parts In-Stock

1+ parts

$8.180

100+ parts

-

1k+ parts

-

10k+ parts

-

110

$8.180

-

-

-

AZTECH Wire

Italy . 866 parts In-Stock

1+ parts

$12.977

100+ parts

-

1k+ parts

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10k+ parts

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866

$12.977

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-

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Lixinc

USA . 15,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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15,877

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West Coast Incorporated

USA . 5,139 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,139

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Argo Parts USA

USA . 1,402 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,402

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Overview

Elevate your digital signal processing capabilities with the DSPIC33FJ128GP708A-E/PT by Microchip Technology. Known for their high-quality products and innovative solutions, Microchip Technology has crafted this powerful 16-bit DSP to deliver exceptional performance in a compact package. Perfect for automotive applications, this DSP offers a maximum clock frequency of 40 MHz and a wide operating temperature range from -40°C to 125°C. With its Flash ROM programmability and low 3.3V supply voltage, this DSP provides unmatched value and flexibility for your projects. Upgrade your designs and unlock new possibilities with the DSPIC33FJ128GP708A-E/PT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for a variety of applications.

Surface Mount: YES

Easily integrated into surface mount technology, saving space and allowing for efficient PCB design.

Maximum Supply Voltage: 3.6 V

Can operate at a relatively high supply voltage, providing flexibility in power options.

Package Shape: SQUARE

Square shape is compact and allows for efficient use of space on PCB.

Bit Size: 16

16-bit processing capability for handling complex digital signal processing tasks.

Power Supplies (V): 3.3

Operates at a common power supply voltage, ensuring compatibility with standard power sources.

No. of Terminals: 80

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE

Flatpack design with thin profile saves space and allows for compact system design.

Minimum Supply Voltage: 3 V

Can operate at a relatively low supply voltage, suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

High maximum temperature rating ensures reliable operation in demanding environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish for reliable electrical connections and solderability.

Terminal Position: QUAD

Quad terminal position for easy layout and assembly on PCB.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Width: 12 mm

Compact width for efficient PCB layout.

Maximum Clock Frequency: 40 MHz

High clock frequency for fast signal processing and response.

Maximum Time At Peak Reflow Temperature (s): 40

Short reflow time for efficient manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder joints.

Length: 12 mm

Compact length for efficient PCB layout.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications with wide temperature range support.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile device that can handle digital signal processing and control functions.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form for easy handling and assembly.

Maximum Supply Current: 90 mA

Low supply current requirement for efficient power usage.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage that ensures stable and reliable operation.

ROM Programmability: FLASH

Flash programmable ROM for flexible and easy firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high density mounting and compact design.

Format: FIXED POINT

Fixed point format for efficient signal processing and accurate calculations.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ128GP708A-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

80

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Trade Compliance

DSPIC33FJ128GP708A-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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