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DSPIC33FJ128GP706A-I/MR

Microchip Technology

DSPIC33FJ128GP706A-I/MR by Microchip Technology

DSPIC33FJ128GP706A-I/MR by Microchip is a 16-bit DSP with max clock freq of 40MHz. Operating at 3.3V, it's ideal for industrial applications due to its flash ROM programmability and CMOS technology. With a temp range of -40 to 85°C, this chip carrier package with matte tin finish offers 64 terminals in a compact square shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,839 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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AZTECH Wire

Italy . 423 parts In-Stock

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$8.094

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$8.094

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Corohmni

South Africa . 64 parts In-Stock

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$20.927

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Aztec Data Supply Inc.

USA . 3,144 parts In-Stock

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$34.170

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$34.170

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Marpe Global Electronics

Taiwan . 6,109 parts In-Stock

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Continental Prestige Electronics

USA . 6,046 parts In-Stock

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Lixinc

USA . 3,379 parts In-Stock

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Argo Parts USA

USA . 3,019 parts In-Stock

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iodParts Technologies Inc.

India . 2,091 parts In-Stock

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QualityLine Systems

Poland . 2,011 parts In-Stock

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XL Components Corporation

Australia . 1,011 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Experience the ultimate in quality and performance with the DSPIC33FJ128GP706A-I/MR from industry leader Microchip Technology. As a leading manufacturer of Digital Signal Processors, Microchip Technology delivers cutting-edge technology that pushes boundaries and opens new possibilities across various applications. With its advanced features and reliable performance, this product offers unparalleled value, benefits, and advantages to customers seeking top-notch solutions for their projects. Trust Microchip Technology to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability to the product, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and providing flexibility in design.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this DSP can handle a wide range of power inputs, making it versatile for different system requirements.

Package Shape: SQUARE

Square package shape provides a compact form factor, allowing for efficient use of board space in electronic designs.

Bit Size: 16

16-bit processing capability enables high-speed and efficient signal processing, suitable for advanced digital applications.

Power Supplies (V): 3.3

Operating at a power supply voltage of 3.3V ensures energy efficiency and compatibility with standard power sources.

No. of Terminals: 64

64 terminals offer ample connectivity options for interfacing with other components in a system, enhancing the versatility of the DSP.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal management and overall performance of the DSP.

Minimum Supply Voltage: 3 V

Having a minimum supply voltage of 3V ensures stable operation and protection against voltage fluctuations, enhancing reliability.

Maximum Operating Temperature: 85 °C

Operates effectively at high temperatures up to 85°C, making it suitable for industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low temperatures down to -40°C, making it suitable for outdoor or harsh environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good electrical conductivity and solderability, providing reliable connections in electronic assemblies.

Terminal Position: QUAD

Quad terminal position simplifies the connection process and allows for secure mounting on PCBs, contributing to ease of installation.

Maximum Seated Height: 1 mm

Low seated height of 1mm ensures compactness and space-saving in electronic designs, especially in applications with size constraints.

Width: 9 mm

With a width of 9mm, the DSP offers a slim profile, suitable for compact devices and applications where space efficiency is crucial.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40MHz enables fast signal processing and high-speed operation, making it ideal for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for up to 40 seconds, ensuring reliable solder joints during assembly processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for proper solder reflow without damaging the components, ensuring quality manufacturing.

Length: 9 mm

Compact length of 9mm contributes to the overall small form factor of the DSP, enabling space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification indicates reliability and suitability for operation in harsh industrial environments with temperature variations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionality expands the capabilities of the product for diverse signal processing and control applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high integration, delivering efficient performance in a compact package.

Terminal Form: NO LEAD

No-lead terminal form simplifies assembly processes, improves reliability, and enhances electrical performance in the system.

Maximum Supply Current: 90 mA

Maximum supply current of 90mA ensures efficient power usage and compatibility with various power sources, enhancing energy efficiency.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides stable and consistent power delivery, essential for reliable operation of the DSP.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and adapting to different application requirements, enhancing the product's versatility.

Terminal Pitch: 0.5 mm

Terminal pitch of 0.5mm allows for high-density mounting on PCBs, enabling compact and miniaturized electronic designs.

Format: FIXED POINT

Fixed-point format facilitates efficient arithmetic operations, enhancing computational accuracy and performance in signal processing tasks.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates proper handling and storage requirements to prevent moisture-related damage, ensuring product reliability.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ128GP706A-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33FJ128GP706A-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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