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DSPIC33EV64GM102-E/SO

Microchip Technology

DSPIC33EV64GM102-E/SO by Microchip Technology

DSPIC33EV64GM102-E/SO by Microchip Technology is a 16-bit DSP with 40 MHz clock frequency, 11-Ch ADC, and 4 DMA channels. Ideal for automotive applications, it features CAN, I2C, SPI connectivity and operates in a temperature range of -40 to 125 °C. It offers low power mode and Flash ROM programmability for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,239 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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AZTECH Wire

Italy . 739 parts In-Stock

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$14.361

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$14.361

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Ampacity Inc.

Singapore . 961 parts In-Stock

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$33.000

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Aztec Data Supply Inc.

USA . 2,753 parts In-Stock

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$51.330

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Corohmni

South Africa . 542 parts In-Stock

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$68.583

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Continental Prestige Electronics

USA . 2,328 parts In-Stock

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RGB Technical Solutions

Ukraine . 2,228 parts In-Stock

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Argo Parts USA

USA . 837 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Enhance your digital signal processing projects with the Microchip Technology DSPIC33EV64GM102-E/SO. As a leader in the industry, Microchip Technology ensures top-notch quality and reliability in their products. This advanced digital signal processor offers unparalleled performance and versatility in applications such as automotive systems, industrial automation, and consumer electronics. With features like multiple peripherals, low power mode, and high-speed operation, this DSP provides exceptional value and benefits to customers looking to elevate their designs. Experience the advantages of cutting-edge technology with the DSPIC33EV64GM102-E/SO from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various applications.

Surface Mount: YES

Easily mountable on PCBs for efficient assembly.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply requirements.

On Chip Data RAM Width: 8

Wide data RAM width for efficient data processing.

Package Shape: RECTANGULAR

Standard shape for ease of integration into designs.

Bit Size: 16

Offers high processing capability for complex algorithms.

Power Supplies (V): 5

Compatible with standard power sources.

No. of Terminals: 28

Plenty of connectivity options for peripheral devices.

Minimum Supply Voltage: 4.5 V

Allows for operation in low voltage conditions.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments like automotive applications.

No. of External Interrupts: 3

Supports external event triggers for efficient task handling.

Terminal Finish: MATTE TIN

Ensures reliable and corrosion-resistant terminal connections.

ADC Channels: YES

Supports analog to digital conversion for sensor interfacing.

DMA Channels: YES

Enables efficient data transfer between peripherals and memory.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Designed specifically for signal processing tasks and control applications.

Connectivity: CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Multiple communication interfaces for versatile connectivity options.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV64GM102-E/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

21

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(4), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Trade Compliance

DSPIC33EV64GM102-E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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