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DSPIC33EP64GS708-E/PT

Microchip Technology

DSPIC33EP64GS708-E/PT by Microchip Technology

DSPIC33EP64GS708-E/PT by Microchip is a 16-bit DSP with 80 terminals, 3-3.6V supply, and 60MHz clock speed. Ideal for automotive applications, it features 22 ADC channels, 2 DAC channels, and peripherals like PWM(16) and TIMER(5).

Median Price

$7.740

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 714 parts In-Stock

1+ parts

$7.740

100+ parts

$6.430

1k+ parts

$5.920

10k+ parts

$5.630

714

$7.740

$6.430

$5.920

$5.630

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 238 parts In-Stock

1+ parts

$7.716

100+ parts

$4.630

1k+ parts

$4.437

10k+ parts

-

238

$7.716

$4.630

$4.437

-

NAC Semi

USA . 595 parts In-Stock

1+ parts

$8.030

100+ parts

$7.280

1k+ parts

$6.660

10k+ parts

-

595

$8.030

$7.280

$6.660

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Vyrian

USA . 4,867 parts In-Stock

1+ parts

-

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4,867

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SIE Connect GmbH - GreenChips

Germany . 1,309 parts In-Stock

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1,309

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Greenchips

USA . 1,071 parts In-Stock

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1,071

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ACDS - Activité Composants Distribution Service

France . 238 parts In-Stock

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238

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Dan-Mar Components

USA . 238 parts In-Stock

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238

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Nova Conductors

Japan . 29 parts In-Stock

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29

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 50 parts In-Stock

1+ parts

$6.551

100+ parts

-

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50

$6.551

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Ampacity Inc.

Singapore . 470 parts In-Stock

1+ parts

$6.580

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-

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470

$6.580

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AZTECH Wire

Italy . 955 parts In-Stock

1+ parts

$13.600

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955

$13.600

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XL Components Corporation

Australia . 7,779 parts In-Stock

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7,779

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QualityLine Systems

Poland . 6,940 parts In-Stock

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6,940

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Marpe Global Electronics

Taiwan . 6,084 parts In-Stock

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6,084

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Overview

Unlock unparalleled performance and efficiency with the DSPIC33EP64GS708-E/PT by Microchip Technology. As a leading manufacturer in the industry, this digital signal processor offers cutting-edge technology ideal for a wide range of applications. With its advanced features and high-quality design, this product delivers unmatched value to customers seeking reliability and versatility. Experience seamless connectivity, enhanced functionality, and superior performance with the DSPIC33EP64GS708-E/PT, setting a new standard in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the DSP, saving time and cost during production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle a wide range of power inputs, making it versatile and adaptable to different systems.

On Chip Data RAM Width: 8

The wide data RAM width allows for faster data processing and manipulation, enhancing the overall performance of the DSP.

Screening Level: AEC-Q100; TS 16949

The AEC-Q100 and TS 16949 screening levels ensure that this DSP meets strict automotive quality standards, making it reliable for use in automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space, making this DSP suitable for compact designs.

Bit Size: 16

With a 16-bit size, this DSP can handle complex calculations and high-resolution data processing, making it suitable for demanding applications.

DAC Channels: YES

The presence of DAC channels allows for analog signal output, enabling the DSP to interface with external devices and sensors.

No. of Terminals: 80

The large number of terminals provides connectivity options for a wide range of peripherals, enhancing the versatility of the DSP.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile package style reduces the overall footprint of the DSP, making it suitable for space-constrained applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP64GS708-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

4

No. of I/O Lines:

67

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(3), UART(2)

Peripherals:

COMPARATOR(4), PWM(16), TIMER(5), WDT

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

DSPIC33EP64GS708-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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