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DSPIC33EP256GP502T-I/MM

Microchip Technology

DSPIC33EP256GP502T-I/MM by Microchip Technology

DSPIC33EP256GP502T-I/MM by Microchip is a 16-bit DSP with 3.3V supplies, 60MHz clock frequency, and 32768 RAM words. Ideal for industrial applications, it features FLASH ROM programmability, 5 timers, and 4 DMA channels for efficient digital signal processing tasks. With a wide operating temperature range (-40 to 85 °C), this chip offers low power mode and boundary scan capabilities.

Median Price

$5.095

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 90 parts In-Stock

1+ parts

$5.095

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-

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90

$5.095

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Vyrian

USA . 6,403 parts In-Stock

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6,403

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Chip Stock

USA . 4,920 parts In-Stock

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4,920

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,556 parts In-Stock

1+ parts

$3.920

100+ parts

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1,556

$3.920

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Continental Prestige Electronics

USA . 5,860 parts In-Stock

1+ parts

$5.095

100+ parts

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$4.993

5,860

$5.095

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$4.993

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$5.095

100+ parts

-

1k+ parts

$4.841

10k+ parts

$4.739

1,000

$5.095

-

$4.841

$4.739

AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$18.190

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417

$18.190

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Corohmni

South Africa . 150 parts In-Stock

1+ parts

$23.894

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150

$23.894

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Aztec Data Supply Inc.

USA . 180 parts In-Stock

1+ parts

$50.582

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180

$50.582

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Authorized Procurement Solutions

USA . 105,960 parts In-Stock

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105,960

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Lixinc

USA . 17,698 parts In-Stock

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NIA Electronics

USA . 7,653 parts In-Stock

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7,653

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Ledger Components

France . 7,653 parts In-Stock

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7,653

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Montano Global Distributors

Canada . 5,062 parts In-Stock

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5,062

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LOOK Integrated Logistics

Peru . 4,087 parts In-Stock

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4,087

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LMD Electronica

Estonia . 3,551 parts In-Stock

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3,551

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Argo Parts USA

USA . 3,104 parts In-Stock

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3,104

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A-Z Elektronik GmbH

Germany . 2,517 parts In-Stock

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2,517

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Alle Elektronik GmbH

Germany . 1,678 parts In-Stock

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1,678

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Overview

Experience exceptional performance and reliability with the DSPIC33EP256GP502T-I/MM from Microchip Technology. As a leading manufacturer of Digital Signal Processors, this chip offers unparalleled value and benefits for a wide range of applications. With its advanced technology and innovative features, customers can expect seamless integration, high efficiency, and top-notch performance. Trust in Microchip Technology to deliver quality products that exceed expectations. Elevate your projects to the next level with the DSPIC33EP256GP502T-I/MM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Maximum Supply Voltage: 3.6 V

Allows for reliable operation within a safe voltage range, preventing damage to the DSP.

RAM Words: 32768

Large RAM capacity enables storage and processing of a significant amount of data, enhancing the performance of the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

This dual functionality enhances the versatility of the product, allowing it to perform both processing and control tasks effectively.

Maximum Clock Frequency: 60 MHz

High clock frequency enables fast data processing and efficient performance of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256GP502T-I/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

DSPIC33EP256GP502T-I/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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