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ATMXT1189TD-ABSPIVAO

Microchip Technology

ATMXT1189TD-ABSPIVAO by Microchip Technology

Microchip Technology's ATMXT1189TD-ABSPIVAO is a 144-terminal capacitive touch screen controller with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 3.14V to 3.47V. Ideal for applications requiring AEC-Q100 screening in automotive electronics.

Median Price

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Lifecycle Status

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3

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1k+

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VNN

France . 728 parts In-Stock

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Vyrian

USA . 523 parts In-Stock

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Nova Conductors

Japan . 91 parts In-Stock

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AZTECH Wire

Italy . 523 parts In-Stock

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Ampacity Inc.

Singapore . 543 parts In-Stock

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$23.000

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QualityLine Systems

Poland . 8,263 parts In-Stock

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Marpe Global Electronics

Taiwan . 4,083 parts In-Stock

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XL Components Corporation

Australia . 3,035 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Discover a world of innovation with the ATMXT1189TD-ABSPIVAO by Microchip Technology. As a global leader in semiconductor manufacturing, Microchip Technology delivers top-quality products that exceed industry standards. This capacitive touch screen controller offers unparalleled precision and reliability, making it ideal for a wide range of applications. From consumer electronics to automotive displays, this versatile IC provides seamless integration and enhanced functionality. Experience the value and benefits of cutting-edge technology with the ATMXT1189TD-ABSPIVAO, where quality meets performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy, efficient mounting onto circuit boards, saving time during assembly.

Maximum Supply Voltage: 3.47 V

Suitable for systems requiring higher voltage, providing flexibility in design.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

Optimizes space utilization on the circuit board, contributing to compact designs.

No. of Terminals: 144

Provides versatility and connectivity options for various circuit configurations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a low-profile design with fine pitch terminals, enhancing integration and reducing space requirements.

Minimum Supply Voltage: 3.14 V

Supports lower voltage applications, offering compatibility with a wide range of systems.

Maximum Operating Temperature: 105 °C

Ensures reliable operation in high-temperature environments, suitable for industrial use.

Minimum Operating Temperature: -40 °C

Maintains functionality in low-temperature conditions, ideal for diverse operating environments.

Terminal Position: QUAD

Facilitates efficient connectivity and signal transmission within the circuit.

Maximum Seated Height: 1.6 mm

Contributes to a compact form factor, enhancing space efficiency in system designs.

Width: 20 mm

Offers a compact footprint for the IC, enabling space-saving integration into electronic devices.

Length: 20 mm

Compact dimensions for the IC, supporting space-constrained applications.

Peripheral IC Type: CAPACITIVE TOUCH SCREEN CONTROLLERS

Provides advanced touch screen control capabilities, enabling user-friendly interfaces in electronic devices.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed operation.

Terminal Form: GULL WING

Facilitates easy soldering and PCB assembly, simplifying the manufacturing process.

Nominal Supply Voltage: 3.3 V

Offers a standard supply voltage for compatibility with a wide range of electronic systems.

Terminal Pitch: 0.5 mm

Provides precise and compact terminal spacing, enabling high-density circuit layouts.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATMXT1189TD-ABSPIVAO attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.14 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

ATMXT1189TD-ABSPIVAO Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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