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ATMXT641TD-ATR

Microchip Technology

ATMXT641TD-ATR by Microchip Technology

Microchip Technology's ATMXT641TD-ATR is a capacitive touch screen controller with 100 terminals in a flatpack, thin profile package. It operates b/w -40 to 85°C with supply voltage range of 3.14V to 3.47V, suitable for automotive applications meeting AEC-Q100 and TS16949 standards.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,304 parts In-Stock

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1,304

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VNN

France . 250 parts In-Stock

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250

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Nova Conductors

Japan . 66 parts In-Stock

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66

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 859 parts In-Stock

1+ parts

$8.433

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859

$8.433

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Ampacity Inc.

Singapore . 221 parts In-Stock

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$20.000

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221

$20.000

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Kepictronics

USA . 21,784 parts In-Stock

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21,784

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Argo Parts USA

USA . 5,374 parts In-Stock

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5,374

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Lixinc

USA . 3,533 parts In-Stock

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3,533

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Perfect Parts

USA . 2,800 parts In-Stock

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2,800

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Continental Prestige Electronics

USA . 664 parts In-Stock

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664

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Marpe Global Electronics

Taiwan . 546 parts In-Stock

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546

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QualityLine Systems

Poland . 546 parts In-Stock

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546

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XL Components Corporation

Australia . 546 parts In-Stock

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546

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Bastille Electronics

Australia . 71 parts In-Stock

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71

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Overview

Enhance the user experience with the ATMXT641TD-ATR by Microchip Technology, a top-tier manufacturer known for its cutting-edge technology. This capacitive touch screen controller offers seamless integration and reliable performance in various applications. With high-quality materials and superior design, this product ensures durability and precision. Elevate your projects with the value and benefits of this innovative solution, providing customers with an exceptional touch experience and unmatched functionality. Trust Microchip Technology to deliver excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.47 V

Supports a high supply voltage for reliable performance.

Screening Level: AEC-Q100; TS 16949

Meets automotive industry standards for quality and reliability.

Package Shape: SQUARE

Space-efficient design for compact electronic devices.

No. of Terminals: 100

Allows for connection to multiple external components.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

Suitable for applications requiring a sleek and compact design.

Minimum Supply Voltage: 3.14 V

Supports a low supply voltage for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without issues.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without issues.

Terminal Position: QUAD

Provides stability and ease of connection.

Maximum Seated Height: 1.2 mm

Low-profile design for space-constrained applications.

Width: 14 mm

Compact size for integration into various electronic devices.

Length: 14 mm

Compact size for integration into various electronic devices.

Peripheral IC Type: CAPACITIVE TOUCH SCREEN CONTROLLERS

Allows for responsive and intuitive user interfaces.

Technology: CMOS

Utilizes low power and allows for high-speed operation.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with other components.

Terminal Form: GULL WING

Facilitates easy soldering and reliable connections.

Terminal Pitch: 0.5 mm

Fine pitch for high-density mounting on circuit boards.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATMXT641TD-ATR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.14 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

ATMXT641TD-ATR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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