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ATMXT1189TD-ABRI2CVAO

Microchip Technology

ATMXT1189TD-ABRI2CVAO by Microchip Technology

Microchip Technology's ATMXT1189TD-ABRI2CVAO is a 144-terminal capacitive touch screen controller with a supply voltage range of 3.14V to 3.47V. It operates b/w -40°C to 105°C, suitable for automotive applications due to AEC-Q100 screening level and low profile flatpack design with 0.5mm terminal pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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VNN

France . 3,523 parts In-Stock

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3,523

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Vyrian

USA . 416 parts In-Stock

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416

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Nova Conductors

Japan . 96 parts In-Stock

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96

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Ampacity Inc.

Singapore . 967 parts In-Stock

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$9.000

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967

$9.000

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AZTECH Wire

Italy . 416 parts In-Stock

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$10.371

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416

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RGB Technical Solutions

Ukraine . 4,344 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Enhance user experiences with the ATMXT1189TD-ABRI2CVAO from Microchip Technology. As a leader in innovative semiconductor solutions, Microchip delivers top-quality products that exceed industry standards. This capacitive touch screen controller offers seamless integration and precise touch sensitivity for various applications. With a wide temperature range and low profile design, this product ensures reliable performance in any environment. Elevate your projects with the ATMXT1189TD-ABRI2CVAO and unlock endless possibilities in touch screen technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material that can protect the internal components of the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.47 V

Can handle higher voltage inputs, providing flexibility in power source options.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, ensuring quality in harsh environments.

Package Shape: SQUARE

Compact design that helps in optimizing space on the circuit board and improves overall aesthetics.

No. of Terminals: 144

Sufficient number of terminals for connecting various components, enhancing versatility in applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Streamlined package design that promotes efficient heat dissipation and improves signal integrity.

Minimum Supply Voltage: 3.14 V

Can operate at low voltage levels, conserving power and increasing energy efficiency.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, suitable for demanding operating conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, offering reliability in various environments.

Terminal Position: QUAD

Quad terminal configuration for efficient connectivity and improved signal transmission.

Maximum Seated Height: 1.6 mm

Low profile design that helps in minimizing the overall height of the product and reduces interference with other components.

Width: 20 mm

Compact width dimensions enable easy integration into circuit board layouts with limited space.

Length: 20 mm

Optimal length for a balanced footprint on the circuit board, maintaining a proportional layout of components.

Peripheral IC Type: CAPACITIVE TOUCH SCREEN CONTROLLERS

Incorporates advanced touch screen technology for intuitive user interface and interactive functionality.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high speed performance, and compatibility with various digital systems.

Terminal Form: GULL WING

Gull wing terminal design for secure and reliable connections during installation, enhancing durability and signal integrity.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance and reliable operation of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections and compact layout, enabling high-density integration on the circuit board.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATMXT1189TD-ABRI2CVAO attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.14 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

ATMXT1189TD-ABRI2CVAO Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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