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APT75GT120JU3

Microchip Technology

APT75GT120JU3 by Microchip Technology

Microchip Technology's APT75GT120JU3 is an N-CHANNEL IGBT with a VCEsat of 2.1V, ideal for POWER CONTROL applications. Featuring a max VCE of 1200V and IC of 100A, this SINGLE transistor with built-in diode has a toff of 610ns and ton of 335ns, making it suitable for high-power operations up to 416W at temperatures up to 150°C.

Median Price

$27.870

Lifecycle Status

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6

In-Stock Inventory

1k+

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Mouser Electronics

USA . 26 parts In-Stock

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$27.870

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Verical

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TME

Poland . 10 parts In-Stock

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$44.600

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Vyrian

USA . 5,789 parts In-Stock

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ComSIT Distribution GmbH

Germany . 470 parts In-Stock

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Nova Conductors

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Aztec Data Supply Inc.

USA . 428 parts In-Stock

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$1.220

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Corohmni

South Africa . 76 parts In-Stock

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$1.706

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AZTECH Wire

Italy . 399 parts In-Stock

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$19.180

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Microchip USA

USA . 4,010 parts In-Stock

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West Coast Incorporated

USA . 8,252 parts In-Stock

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Argo Parts USA

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Glotronic Ltd.

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Continental Prestige Electronics

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Overview

Unleash the power of innovation with the APT75GT120JU3 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. Ideal for power control applications, this N-CHANNEL transistor offers a single configuration with a built-in diode, providing unmatched efficiency and reliability. With a maximum collector-emitter voltage of 1200V and a maximum power dissipation of 416W, this transistor is designed to exceed expectations in performance. Elevate your projects to new heights with the APT75GT120JU3 and experience the difference that true quality makes.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs offer lower conduction losses and higher efficiency, making them a good choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, making this IGBT convenient and reliable for power control.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficient and reliable performance in controlling large amounts of power.

Maximum VCEsat: 2.1 V

The low VCEsat voltage drop minimizes power losses in the transistor, leading to higher efficiency and reduced heat generation.

Nominal Turn Off Time (toff): 610 ns

The fast turn-off time ensures quick switching and response, crucial for efficient power control and reducing switching losses.

Maximum Power Dissipation (Abs): 416 W

With a high maximum power dissipation rating, this IGBT can handle high power levels without overheating or performance degradation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the IGBT to be used in a wide range of environments and applications without risking thermal damage.

Maximum Collector-Emitter Voltage: 1200 V

The high voltage rating of the collector-emitter junction enables this IGBT to control high voltages safely and efficiently.

Maximum Gate-Emitter Voltage: 20 V

The low gate-emitter voltage ensures easy and precise control of the IGBT, contributing to reliable and stable operation in power control circuits.

Maximum Collector Current (IC): 100 A

With a high collector current rating, this IGBT can handle large current loads, making it suitable for high-power applications that require substantial current handling capabilities.

Nominal Turn On Time (ton): 335 ns

The fast turn-on time improves the responsiveness and switching speed of the IGBT, enhancing its overall performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) APT75GT120JU3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Microchip Technology

Specs

Additional Features:

AVALANCHE RATED, LOW CONDUCTION LOSS

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

335 ns

Maximum VCEsat:

2.1 V

Trade Compliance

APT75GT120JU3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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