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APT60GT60JRDQ3

Microchip Technology

APT60GT60JRDQ3 by Microchip Technology

APT60GT60JRDQ3 by Microchip Technology is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 105A max collector current, and 379W max power dissipation. It is used for power control applications due to its single configuration with built-in diode and fast turn-off time of 320ns. The transistor's package style is flange mount with a rectangular shape and isolated case connection.

Median Price

$39.790

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 99 parts In-Stock

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$39.790

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Vyrian

USA . 1,123 parts In-Stock

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AZTECH Wire

Italy . 701 parts In-Stock

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$18.120

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Continental Prestige Electronics

USA . 2,762 parts In-Stock

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$38.994

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Netroflash

USA . 50 parts In-Stock

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$39.790

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Microchip USA

USA . 223 parts In-Stock

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$91.517

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QUARKTWIN TECHNOLOGY LTD

USA . 12,614 parts In-Stock

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Argo Parts USA

USA . 3,293 parts In-Stock

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Fulton Briggs Corp.

USA . 1,787 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Unlock the power of efficient and reliable power control with the APT60GT60JRDQ3 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers high-quality Insulated Gate Bipolar Transistors (IGBT) that offer unparalleled performance and durability. Ideal for a wide range of applications, this N-CHANNEL transistor with built-in diode provides customers with maximum power dissipation of 379W and a maximum collector-emitter voltage of 600V. With a nominal turn-off time of 320ns and a nominal turn-on time of 51ns, this product ensures smooth operation and optimal efficiency. Upgrade your power control systems with the APT60GT60JRDQ3 and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, increasing durability and reliability.

Polarity or Channel Type: N-CHANNEL

Enhances efficiency and allows for high power handling capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Offers additional functionality and versatility for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in such scenarios.

Package Shape: RECTANGULAR

Facilitates easy mounting and integration into various electronic systems.

Nominal Turn Off Time (toff): 320 ns

Provides fast turn-off time, crucial for efficient power control operations.

No. of Terminals: 4

Offers multiple connection points for enhanced versatility in circuit design.

Maximum Power Dissipation (Abs): 379 W

Capable of handling high power levels without overheating or damage.

Package Style (Meter): FLANGE MOUNT

Allows for secure mounting and heat dissipation in various applications.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for industrial environments.

Maximum Collector-Emitter Voltage: 600 V

Suitable for high voltage applications, offering a wide range of power control capabilities.

Transistor Element Material: SILICON

Provides reliable performance and durability for long-term use.

Maximum Gate-Emitter Voltage: 30 V

Allows for precise control and modulation of the transistor's operation.

Maximum Collector Current (IC): 105 A

Capable of handling high current levels for power control applications.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and corrosion resistance for reliable connections.

Terminal Position: UPPER

Facilitates easy installation and connections in electronic circuits.

Case Connection: ISOLATED

Provides electrical isolation for added safety and protection in circuits.

Nominal Turn On Time (ton): 51 ns

Offers fast turn-on time for quick response in power control operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) APT60GT60JRDQ3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Microchip Technology

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Voltage:

30 V

JESD-30 Code:

R-PUFM-X4

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

320 ns

Nominal Turn On Time (ton):

51 ns

Trade Compliance

APT60GT60JRDQ3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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