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APT40GP90JDQ2

Microchip Technology

APT40GP90JDQ2 by Microchip Technology

APT40GP90JDQ2 by Microchip Technology is an N-CHANNEL IGBT with a max voltage of 900V and current of 64A. It has a turn-off time of 220ns and turn-on time of 37ns, making it ideal for power control applications. This single transistor with built-in diode comes in a flange mount package style, suitable for high-temperature environments up to 150°C.

Median Price

$40.100

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

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TME

Poland . 20 parts In-Stock

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Vyrian

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Nova Conductors

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AZTECH Wire

Italy . 245 parts In-Stock

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Aztec Data Supply Inc.

USA . 10 parts In-Stock

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Corohmni

South Africa . 275 parts In-Stock

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Semicontronic

India . 1,545 parts In-Stock

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$36.124

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$35.938

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Ampacity Inc.

Singapore . 1,383 parts In-Stock

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XL Components Corporation

Australia . 7,011 parts In-Stock

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Microchip USA

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Argo Parts USA

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Continental Prestige Electronics

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Marpe Global Electronics

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Overview

Elevate your power control applications with the APT40GP90JDQ2 by Microchip Technology. This high-quality N-channel insulated gate bipolar transistor offers a single configuration with a built-in diode, making it a versatile choice for a range of projects. With a maximum collector-emitter voltage of 900V and a nominal turn-off time of just 220 ns, this transistor delivers reliable performance in demanding environments. Trust in the expertise of Microchip Technology to bring you cutting-edge technology that maximizes efficiency and effectiveness in your designs. Experience the value and benefits of the APT40GP90JDQ2 today.

Feature Benefit Bullets

Polarity or Channel Type N-CHANNEL

N-channel IGBTs typically offer lower on-state voltage drop and higher current carrying capacity, making them suitable for high power applications.

Configuration SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects against reverse current flow, increasing efficiency and reliability.

Transistor Application POWER CONTROL

This IGBT is specifically designed for power control applications, ensuring optimal performance and efficiency in controlling high power.

Package Shape RECTANGULAR

Rectangular package shape allows for easy mounting and integration into various electronic systems.

Nominal Turn Off Time (toff) 220 ns

Fast turn off time ensures efficient switching and reduced power losses in high frequency applications.

No. of Terminals 4

4 terminals provide easy connectivity and integration in circuit designs.

Package Style (Meter) FLANGE MOUNT

Flange mount package style allows for secure mounting and stable connection in high vibration environments.

Maximum Operating Temperature 150 °C

High maximum operating temperature allows for operation in harsh environments without compromising performance.

Maximum Collector-Emitter Voltage 900 V

High maximum collector-emitter voltage rating ensures the IGBT can handle high voltage applications safely.

Transistor Element Material SILICON

Silicon-based IGBTs offer good thermal conductivity and high breakdown voltage, making them reliable for high power applications.

Maximum Collector Current (IC) 64 A

High maximum collector current rating allows for handling of large currents without risk of damage or overheating.

Terminal Position UPPER

Upper terminal position facilitates easy connections and efficient heat dissipation in circuit designs.

Case Connection ISOLATED

Isolated case connection ensures electrical insulation and prevents short circuits, improving overall system safety.

Nominal Turn On Time (ton) 37 ns

Fast turn on time enables quick switching and low conduction losses, enhancing overall efficiency of the power control circuit.

Reference Standard UL RECOGNIZED

UL recognition ensures compliance with safety and quality standards, providing peace of mind for users in terms of product reliability and safety.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) APT40GP90JDQ2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Microchip Technology

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

900 V

JESD-30 Code:

R-XUFM-X4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

220 ns

Nominal Turn On Time (ton):

37 ns

Trade Compliance

APT40GP90JDQ2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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