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APT40GP90J

Microchip Technology

APT40GP90J by Microchip Technology

Microchip Technology's APT40GP90J is an N-CHANNEL IGBT for POWER CONTROL applications. With VCEsat of 3.9V, it has a max IC of 68A and Ptot of 284W. Featuring a toff of 215ns and ton of 43ns, this device operates at up to 150°C with VCEmax at 900V.

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 1,485 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Aztec Data Supply Inc.

USA . 171 parts In-Stock

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$0.920

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Corohmni

South Africa . 686 parts In-Stock

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$1.681

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AZTECH Wire

Italy . 536 parts In-Stock

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Ampacity Inc.

Singapore . 668 parts In-Stock

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$19.050

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QUARKTWIN TECHNOLOGY LTD

USA . 26,861 parts In-Stock

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Microchip USA

USA . 7,333 parts In-Stock

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Continental Prestige Electronics

USA . 6,790 parts In-Stock

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RGB Technical Solutions

Ukraine . 5,289 parts In-Stock

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Argo Parts USA

USA . 3,566 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Perfect Parts

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Overview

Discover the power of the APT40GP90J by Microchip Technology, a high-quality Insulated Gate Bipolar Transistor designed for power control applications. With its N-channel configuration and maximum collector-emitter voltage of 900V, this single transistor offers unmatched performance and reliability. The APT40GP90J features a fast turn-off time of 215ns and a low VCEsat of 3.9V, making it ideal for high-power applications. Trust in Microchip Technology's expertise and choose the APT40GP90J for your next project to experience unparalleled efficiency and precision in power control.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the internal components, making it suitable for various applications.

Polarity or Channel Type:

N-CHANNEL - Offers efficient power control and versatility in electronic systems.

Configuration:

SINGLE - Simplifies circuit design and assembly, ideal for standalone power control applications.

Transistor Application:

POWER CONTROL - Ensures reliable and precise management of power distribution in electronic devices.

Maximum VCEsat:

3.9 V - Low VCE saturation voltage results in reduced power dissipation, enhancing energy efficiency.

Package Shape:

RECTANGULAR - Facilitates easy mounting and integration into different electronic systems.

Nominal Turn Off Time (toff):

215 ns - Fast turn-off time improves efficiency and prevents overheating in high-power applications.

No. of Terminals:

4 - Provides easy connectivity and compatibility with standard electronic circuits.

Maximum Power Dissipation (Abs):

284 W - High power dissipation capacity makes it suitable for handling heavy loads and power spikes.

Package Style (Meter):

FLANGE MOUNT - Allows for secure attachment and heat dissipation in industrial settings.

Maximum Operating Temperature:

150 °C - Withstands high operating temperatures, ensuring reliability in extreme environments.

Maximum Collector-Emitter Voltage:

900 V - Handles high voltage applications without compromising performance or safety.

Transistor Element Material:

SILICON - Offers high reliability and performance in a wide range of operating conditions.

Maximum Gate-Emitter Voltage:

20 V - Provides safe and stable operation within specified voltage limits.

Maximum Collector Current (IC):

68 A - Capable of handling high current loads for power control applications.

Terminal Position:

UPPER - Simplifies installation and maintenance of the IGBT in electronic systems.

Case Connection:

ISOLATED - Ensures electrical insulation and protection for safer operation in diverse environments.

Nominal Turn On Time (ton):

43 ns - Quick turn-on time enhances responsiveness and efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) APT40GP90J attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Microchip Technology

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

900 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PUFM-X4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

215 ns

Nominal Turn On Time (ton):

43 ns

Maximum VCEsat:

3.9 V

Trade Compliance

APT40GP90J Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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