Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MEMORY CIRCUIT; Package Shape: UNSPECIFIED; No. of Functions: 1; JESD-30 Code: X-XXSS-X; Technology: CMOS; Terminal Form: UNSPECIFIED;
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Mouser Electronics
$1.260
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DigiKey
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Digiode
$1.311
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Native Components
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Northwest PG Solutions
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Semicontronic
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Corphita
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MARBEL Systems
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Texas Native Microelectronics
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Other Function Memory ICs DS9093RB+ attributes and parameters. Explore more Other Function Memory ICs devices from Maxim Integrated
JESD-30 Code:
JESD-609 Code:
Memory IC Type:
No. of Functions:
Package Body Material:
Package Shape:
Package Style (Meter):
Qualification:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Position:
DS9093RB+ Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
3926.90.99.85
SB
3926.90.99.88
Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.
President & CEO
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Vivek Jain
Fabrication
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Cavite
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489,000
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Beaverton
312,000
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194,000
2N2222A
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
LM317T by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. Operating temperature ranges from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. With a max output current of 1.5A, this through-hole package regulator is ideal for power supply designs where adjustable voltage levels are needed.
1N4148WT
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
EU2B-YS2J03F
Idec
ROTARY SWITCH;
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
FDV304P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
BSS138K-13
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
NDT2955
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
Db Lectro
Eic Semiconductor
1N4148WS
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SN74HC670JP4
SN74HC670JP4 by Texas Instruments is a CMOS memory IC with 16 terminals in an IN-LINE package. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies ranging from 2V to 6V, it offers reliable performance in various electronic devices.
SN74AS871N3
SN74AS871N3 by Texas Instruments is a TTL technology IC with 28 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. With a rectangular plastic/epoxy body, it is commonly used in other function memory circuits.
M28F221-80XN6
STMicroelectronics
Other Memory ICs;
DS1961S-F5
Dallas Semiconductor
TMS27P32N25
SAA4955HL
NXP Semiconductors
The NXP Semiconductors SAA4955HL is a 3.3V synchronous memory IC with 2949264-bit density and 21ns access time. It features a flatpack package style, quad terminal position, and operates in commercial temperature grade. Ideal for applications requiring high-speed memory circuits in electronic devices.
TMS27P32N45
TMS2150-45DW
TMS2150-45DW by Texas Instruments is a 512x9 MOS memory IC with 45ns access time and 135mA supply current. It operates at temperatures from 0 to 70°C, making it suitable for commercial applications requiring fast data retrieval in a small outline package.
DS28C39Q+T
Analog Devices
MEMORY CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Matte Tin (Sn) - annealed;
MR0A16ACYS35
Everspin Technologies
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SN54HC670FK
SN54HC670FK by Texas Instruments is a CMOS memory IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -55°C to 125°C, suitable for military-grade applications. It has power supplies of 2-6V and is surface mountable, making it ideal for compact electronic devices.
M30082040054X0IWAY
Renesas Electronics
Renesas Electronics M30082040054X0IWAY is a 1MX8 MEMORY CIRCUIT IC with 8388608 bit memory density. It operates synchronously at 3V, in a small outline package suitable for surface mounting. With an operating temperature range of -40 to 85 °C, it's ideal for applications requiring high-speed synchronous memory functions.
M36W108T120ZN1T
STMicroelectronics M36W108T120ZN1T is a 1MX8 memory IC with 8388608 bit memory density. It operates in asynchronous mode, with CMOS technology and 2.7-3.6V supply voltage range. Suitable for commercial applications, it features a grid array package style and very thin profile for compact designs.
DS1994L-F5+
Maxim Integrated
DS1994L-F5+ by Maxim Integrated is a 4096-bit MEMORY CIRCUIT with 4KX1 organization. It operates in ASYNCHRONOUS mode at temperatures from -40 to 70°C. This METAL package IC has a ROUND shape, DISK BUTTON style, and is suitable for various memory applications.
WSF128K16-37G1UM
Microsemi
Microsemi's WSF128K16-37G1UM is a 128Kx16 memory IC with CMOS technology. Operating at 5V, it has a memory density of 2097152 bits and operates in asynchronous mode. Ideal for military applications due to its temperature grade and quad terminal position.
CY8C20110-SX2IT
Infineon Technologies
MEMORY CIRCUIT; Moisture Sensitivity Level (MSL): 3;
TMS27PC32-150JE4
CY15B108QN-20LPXCES
CY15B108QN-20LPXCES by Infineon Technologies is a 1MX8 MEMORY CIRCUIT with 8388608 bit Memory Density. It operates at 3.3V, has a small outline package style, and synchronous operating mode. Ideal for applications requiring high memory capacity in commercial temperature environments.
SN74170J4
SN74170J4 by Texas Instruments is a TTL technology IC with 16 terminals, operating at 5V. It has a rectangular ceramic package style and can function in temperatures ranging from 0 to 70°C. This memory IC is commonly used in commercial applications requiring reliable data storage and retrieval.
M36W0R5020B0ZAQE
M36W0R5020B0ZAQE by STMicroelectronics is a versatile memory IC featuring 2M words of mixed FLASH+SRAM with a max access time of 70 ns. It operates asynchronously at a nominal voltage of 1.8V, suitable for industrial applications. Its compact design ensures efficient space utilization in electronic devices.
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DS9093S
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Terminal Form: UNSPECIFIED; Qualification: Not Qualified; Technology: CMOS; JESD-609 Code: e0;
DS9093S+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Terminal Form: UNSPECIFIED; JESD-609 Code: e3; Technology: CMOS; Terminal Finish: MATTE TIN;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; Terminal Form: UNSPECIFIED; Surface Mount: NO; No. of Functions: 1;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; Qualification: Not Qualified; No. of Functions: 1; JESD-609 Code: e0;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-609 Code: e3; JESD-30 Code: X-XXSS-X; Terminal Form: UNSPECIFIED; Technology: CMOS;
DS9093RA
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; Terminal Position: UNSPECIFIED; Terminal Form: UNSPECIFIED; Terminal Finish: TIN LEAD;
DS90922R-L00
MEMORY CIRCUIT; No. of Terminals: 2; Package Shape: ROUND; Qualification: Not Qualified; Surface Mount: NO; Package Style (Meter): CYLINDRICAL;
DS9093F
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED; Surface Mount: NO;
DS9093RA+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Package Style (Meter): SPECIAL SHAPE; Technology: CMOS; JESD-609 Code: e3; Terminal Form: UNSPECIFIED;
DS9093RB
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED; Terminal Form: UNSPECIFIED;
DS90922R-000
MEMORY CIRCUIT; No. of Terminals: 2; Package Shape: ROUND; JESD-609 Code: e0; JESD-30 Code: O-MBCY-T2; Qualification: Not Qualified;
DS9093RB+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; No. of Functions: 1; Terminal Finish: Matte Tin (Sn) - annealed; Technology: CMOS; Qualification: Not Qualified;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; No. of Functions: 1; JESD-609 Code: e0; Terminal Finish: TIN LEAD; JESD-30 Code: X-XXSS-X;
DS9092R-000
MEMORY CIRCUIT; No. of Terminals: 2; Package Shape: ROUND; Package Body Material: METAL; Terminal Position: BOTTOM; JESD-609 Code: e0;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Surface Mount: NO; Qualification: Not Qualified; Terminal Finish: MATTE TIN; Package Body Material: UNSPECIFIED;
DS9093F+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Package Style (Meter): SPECIAL SHAPE; Terminal Form: UNSPECIFIED; JESD-609 Code: e3; Qualification: Not Qualified;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Terminal Finish: TIN LEAD; Package Style (Meter): SPECIAL SHAPE; Surface Mount: NO; Package Body Material: UNSPECIFIED;
DS9093P+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; No. of Functions: 1; JESD-609 Code: e3; Qualification: Not Qualified;
DS9093P
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Terminal Form: UNSPECIFIED; Technology: CMOS; JESD-609 Code: e0;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Surface Mount: NO; Technology: CMOS; Terminal Position: UNSPECIFIED; JESD-30 Code: X-XXSS-X;
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