Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Terminal Finish: TIN LEAD; Package Style (Meter): SPECIAL SHAPE; Surface Mount: NO; Package Body Material: UNSPECIFIED;
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Other Function Memory ICs DS9093F attributes and parameters. Explore more Other Function Memory ICs devices from Maxim Integrated
JESD-30 Code:
JESD-609 Code:
Memory IC Type:
No. of Functions:
Package Body Material:
Package Shape:
Package Style (Meter):
Qualification:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Position:
DS9093F Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
3926.90.99.85
SB
3926.90.99.88
NSN
5962-01-586-3563, 5962015863563
NIIN
015863563
Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.
President & CEO
Tunc Doluca
Senior VP & CFO
Brian C. White
Senior VP, Technology & Manufacturing Group
Vivek Jain
Fabrication
Fab Initiation
Philippines
Cavite
Wafer Capacity
489,000
USA
Beaverton
312,000
Thailand
Chon Buri
194,000
SMBJ18CA
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Lite-on Semiconductor
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
LM317AEMP/NOPB
Texas Instruments
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
Thinking Electronic Industrial
1N4148
Crimson Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
OPA2277UA/2K5
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Gulf Semiconductor
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
RC0603FR-071KL
Yageo
Yageo's RC0603FR-071KL is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 155 °C with a temperature coefficient of 100 ppm/°C.
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
Continental Device India
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
MB85RS4MTYPN-G-AWEWE1
Fujitsu
Other Memory ICs; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 255; Maximum Time At Peak Reflow Temperature (s): 5;
TMS27P64N25
Other Memory ICs;
ST25DV16K-JFR6D3
ST25DV16K-JFR6D3 by STMicroelectronics is a 16Kx1 memory IC with CMOS technology. Operating at 3.3V, it has a temperature range of -40 to 85°C and a package style of small outline, heat sink/slug, very thin profile. Ideal for industrial applications requiring high memory density and synchronous operation in a compact square package.
M36P0R9070E0ZACE
M36P0R9070E0ZACE by STMicroelectronics is a versatile memory IC featuring 32M words of mixed FLASH+PSRAM, operating at 1.8V with a max access time of 70ns. Its compact design (11x8mm) and asynchronous mode make it ideal for space-constrained applications. It operates in extreme temperatures from -30 °C to 85°C, ensuring reliability in various environments.
MTFDDAK7T6QDE-2AV1ZABYY
Micron Technology
MEMORY CIRCUIT;
KLMBG4GE4A-A001
Samsung
M36LLR8860M1ZAQE
M36LLR8860M1ZAQE by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM. It operates at 1.8V with a max temp of 85 °C and supports surface mount applications. Ideal for compact devices requiring efficient memory solutions.
SN74AS871JD4
SN74AS871JD4 by Texas Instruments is a TTL memory IC with 28 terminals in an IN-LINE package. Operating temperature range of 0-70°C, ideal for commercial applications. Features ceramic body material and rectangular shape, suitable for various electronic functions.
TMS27PC32-120JL
DS2400Y
Analog Devices
Analog Devices' DS2400Y is a 3-terminal memory IC with a supply voltage of 5V, suitable for industrial applications. It operates b/w -40 °C to 85°C and features tin-lead terminal finish in a surface-mount plastic/epoxy package.
TMS27PC49-4JTL
IRMCF171TR
International Rectifier
TMS2400JC
TMS2400JC by Texas Instruments is a MOS technology memory IC with 28 terminals in an IN-LINE package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage in harsh environments. The CERAMIC package ensures durability and stability, ideal for industrial and automotive electronics.
M36W0R6030B0ZAQ
M36W0R6030B0ZAQ by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It supports asynchronous access with a max temp of 85 °C and is ideal for industrial applications requiring reliable data storage. Its compact design (10mm x 8mm) ensures efficient integration in space-constrained environments.
MR25H256ACDF
Everspin Technologies
MR25H256ACDF by Everspin Technologies is a 32KX8 SPI BUS SERIAL EEPROM memory IC with a memory density of 262144 bits. It operates at a nominal voltage of 3V and has an industrial temperature grade. This memory IC is suitable for applications requiring small outline, heat sink, and very thin profile packages.
M30162040108X0IWAY
Integrated Device Technology
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Memory Width: 8; JESD-30 Code: R-PDSO-N8;
AT88SC0104CA-SH
Atmel
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
AT88SC0104CA-SH-T
Microchip Technology
Microchip AT88SC0104CA-SH-T is a 1024-bit Crypto Memory IC with 128x8 organization. Operating in synchronous mode, it has a memory width of 8 and operates b/w -40°C to 85°C. Ideal for secure applications requiring small outline packages and dual terminal positions.
FM33256B-G
Infineon Technologies
FM33256B-G by Infineon Technologies is a 32KX8 EEPROM+FLASH memory IC with 32768 words and 262144 bit memory density. Operating in synchronous mode, it has a supply voltage range of 2.7V to 3.6V, making it suitable for industrial applications requiring reliable non-volatile memory storage in a small outline package.
SN74LS603ADWR
SN74LS603ADWR by Texas Instruments is a 64KX1 MEMORY CIRCUIT IC with TTL technology. It operates asynchronously at 5V, has 65536-bit memory density, and comes in a small outline package. Ideal for applications requiring reliable memory storage in commercial temperature environments.
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DS9093S
Maxim Integrated
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Terminal Form: UNSPECIFIED; Qualification: Not Qualified; Technology: CMOS; JESD-609 Code: e0;
DS9093S+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Terminal Form: UNSPECIFIED; JESD-609 Code: e3; Technology: CMOS; Terminal Finish: MATTE TIN;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; Terminal Form: UNSPECIFIED; Surface Mount: NO; No. of Functions: 1;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; Qualification: Not Qualified; No. of Functions: 1; JESD-609 Code: e0;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-609 Code: e3; JESD-30 Code: X-XXSS-X; Terminal Form: UNSPECIFIED; Technology: CMOS;
DS9093RA
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; Terminal Position: UNSPECIFIED; Terminal Form: UNSPECIFIED; Terminal Finish: TIN LEAD;
DS90922R-L00
MEMORY CIRCUIT; No. of Terminals: 2; Package Shape: ROUND; Qualification: Not Qualified; Surface Mount: NO; Package Style (Meter): CYLINDRICAL;
DS9093F
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED; Surface Mount: NO;
DS9093RA+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Package Style (Meter): SPECIAL SHAPE; Technology: CMOS; JESD-609 Code: e3; Terminal Form: UNSPECIFIED;
DS9093RB
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED; Terminal Form: UNSPECIFIED;
DS90922R-000
MEMORY CIRCUIT; No. of Terminals: 2; Package Shape: ROUND; JESD-609 Code: e0; JESD-30 Code: O-MBCY-T2; Qualification: Not Qualified;
DS9093RB+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; No. of Functions: 1; Terminal Finish: Matte Tin (Sn) - annealed; Technology: CMOS; Qualification: Not Qualified;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; No. of Functions: 1; JESD-609 Code: e0; Terminal Finish: TIN LEAD; JESD-30 Code: X-XXSS-X;
DS9092R-000
MEMORY CIRCUIT; No. of Terminals: 2; Package Shape: ROUND; Package Body Material: METAL; Terminal Position: BOTTOM; JESD-609 Code: e0;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Surface Mount: NO; Qualification: Not Qualified; Terminal Finish: MATTE TIN; Package Body Material: UNSPECIFIED;
DS9093F+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Package Style (Meter): SPECIAL SHAPE; Terminal Form: UNSPECIFIED; JESD-609 Code: e3; Qualification: Not Qualified;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; No. of Functions: 1; JESD-30 Code: X-XXSS-X; Technology: CMOS; Terminal Form: UNSPECIFIED;
DS9093P+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; No. of Functions: 1; JESD-609 Code: e3; Qualification: Not Qualified;
DS9093P
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Terminal Form: UNSPECIFIED; Technology: CMOS; JESD-609 Code: e0;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; JESD-30 Code: X-XXSS-X; Terminal Form: UNSPECIFIED; Package Style (Meter): SPECIAL SHAPE;
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