Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Terminal Form: UNSPECIFIED; Technology: CMOS; JESD-609 Code: e0;
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Other Function Memory ICs DS9093P attributes and parameters. Explore more Other Function Memory ICs devices from Maxim Integrated
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JESD-609 Code:
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No. of Functions:
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DS9093P Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.
President & CEO
Tunc Doluca
Senior VP & CFO
Brian C. White
Senior VP, Technology & Manufacturing Group
Vivek Jain
Fabrication
Fab Initiation
Philippines
Cavite
Wafer Capacity
489,000
USA
Beaverton
312,000
Thailand
Chon Buri
194,000
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
LL4148
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Rectron
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS84-7-F
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
Eic Semiconductor
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Surge Components
Rfe International
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
TMS44C250-1DZ
Texas Instruments
TMS44C250-1DZ by Texas Instruments is a 256Kx4 memory IC with 1048576-bit density. It operates at 5V, has a max access time of 100ns, and consumes up to 110mA. This CMOS technology-based chip is ideal for commercial applications requiring fast memory access in small outline packages.
SN74AS870JT4
SN74AS870JT4 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. With a ceramic body material and rectangular shape, it is ideal for various memory functions.
M36W108T120ZM5
M36W108T120ZM5 from STMicroelectronics is a low-profile, asynchronous mixed memory IC featuring 1M x 8 organization with Flash+SRAM technology. It operates b/w -20 °C to 85°C and supports power supplies of 2.7V to 3.6V. Ideal for compact applications requiring efficient data storage and retrieval.
TMS27C32-150NE4
Other Memory ICs;
47L04-E/ST
Microchip Technology
47L04-E/ST by Microchip Technology is a small outline, thin profile memory IC with 512x8 organization. It operates synchronously and combines EEPROM with SRAM technology. Ideal for automotive applications, it has a temperature range of -40 to 125°C and requires a supply voltage b/w 2.7V to 3.6V.
47C16-I/SN
47C16-I/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with 2KX8 organization. It operates at a voltage range of 4.5V to 5.5V and has a memory density of 16384 bits. This small outline package is ideal for industrial applications requiring fast access times and reliable data storage.
AT88SC018-SU-CN
Atmel
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
MR2A16ACMA35
Everspin Technologies
MR2A16ACMA35 by Everspin: 256KX16 memory IC with 35ns access time, operates at 3.3V. Suitable for industrial applications, features low profile grid array package and CMOS technology.
M36P0R8070E0ZACE
M36P0R8070E0ZACE by STMicroelectronics is a synchronous memory IC featuring a mixed FLASH+PSRAM configuration with 16M words and a density of 268M bits. It operates at a nominal voltage of 1.8V, suitable for compact applications. Its thin profile and grid array design make it ideal for space-constrained devices.
TMS27PC240-10FLE
SN74LS170J4
SN74LS170J4 by Texas Instruments is a TTL technology IC with 16 terminals and a supply voltage of 5V. It operates b/w 0-70°C, housed in a ceramic rectangular package. Commonly used for memory functions in commercial applications due to its reliability and temperature range suitability.
M36W108T100ZN1T
M36W108T100ZN1T by STMicroelectronics is a 1MX8 memory IC with 8388608 bit memory density. Operating in asynchronous mode, it has a supply voltage range of 2.7V to 3.6V and operates within a temperature range of 0 °C to 70°C. This rectangular package with grid array style is suitable for various commercial applications requiring high-density memory solutions.
TMS4C1060-60SD
TMS4C1060-60SD by Texas Instruments is a 20-terminal MEMORY CIRCUIT IC with 5V supply, 50ns access time, and 35mA max supply current. It operates b/w 0-70°C in commercial grade applications requiring reliable memory storage solutions.
DS2401/T&R
Maxim Integrated
DS2401/T&R by Maxim Integrated is a 64-bit MEMORY CIRCUIT with 3 terminals, operating at 5V. It has a cylindrical package shape and is ideal for industrial applications requiring asynchronous operation in temperatures ranging from -40 to 85°C.
MR25H256ACDF
MR25H256ACDF by Everspin Technologies is a 32KX8 SPI BUS SERIAL EEPROM memory IC with a memory density of 262144 bits. It operates at a nominal voltage of 3V and has an industrial temperature grade. This memory IC is suitable for applications requiring small outline, heat sink, and very thin profile packages.
MR0A16AYS35R
Freescale Semiconductor
MR0A16AYS35R by Freescale Semiconductor is a 64KX16 memory circuit with a supply voltage of 3.3V. It operates in asynchronous mode and has a max access time of 35ns. This memory IC is commonly used in applications requiring high-speed data storage and retrieval.
SNJ54AS870FH
SNJ54AS870FH by Texas Instruments is a MILITARY-grade TTL IC with 28 terminals in a CHIP CARRIER package. Operating temperature range from -55 to 125 °C, suitable for harsh environments. Ideal for applications requiring high reliability and performance in military and aerospace industries.
M36W216T100ZA1
M36W216T100ZA1 from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal supply and operates b/w 2.7V to 3.3V. It features a density of 16Mbit, organized as 1Mx16, and supports commercial temp ranges up to 70 °C. Ideal for compact applications requiring efficient data storage in embedded systems.
M38510/31901BEX
M38510/31901BEX by Texas Instruments is a MILITARY-grade MEMORY CIRCUIT with 16-bit memory density. It operates ASYNCHRONOUSLY at temperatures ranging from -55 to 125 °C, ideal for applications requiring reliable performance in harsh environments. The IC features a 4x4 organization and comes in a CERAMIC, METAL-SEALED COFIRED package with 16 terminals.
SNC54LS170W
SNC54LS170W by Texas Instruments is a MIL-STD-883 Class B (Modified) rated TTL IC with 16 terminals and a supply voltage of 5V. Its ceramic package can operate b/w -55°C to 125°C, making it suitable for military-grade applications requiring reliable memory functions in harsh environments. This rectangular flatpack IC is surface mountable and ideal for use in rugged electronic systems where high temperature tolerance and durability are essential.
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DS9093S
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Terminal Form: UNSPECIFIED; Qualification: Not Qualified; Technology: CMOS; JESD-609 Code: e0;
DS9093S+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Terminal Form: UNSPECIFIED; JESD-609 Code: e3; Technology: CMOS; Terminal Finish: MATTE TIN;
Dallas Semiconductor
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; Terminal Form: UNSPECIFIED; Surface Mount: NO; No. of Functions: 1;
Analog Devices
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; Qualification: Not Qualified; No. of Functions: 1; JESD-609 Code: e0;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-609 Code: e3; JESD-30 Code: X-XXSS-X; Terminal Form: UNSPECIFIED; Technology: CMOS;
DS9093RA
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; Terminal Position: UNSPECIFIED; Terminal Form: UNSPECIFIED; Terminal Finish: TIN LEAD;
DS90922R-L00
MEMORY CIRCUIT; No. of Terminals: 2; Package Shape: ROUND; Qualification: Not Qualified; Surface Mount: NO; Package Style (Meter): CYLINDRICAL;
DS9093F
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED; Surface Mount: NO;
DS9093RA+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Package Style (Meter): SPECIAL SHAPE; Technology: CMOS; JESD-609 Code: e3; Terminal Form: UNSPECIFIED;
DS9093RB
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED; Terminal Form: UNSPECIFIED;
DS90922R-000
MEMORY CIRCUIT; No. of Terminals: 2; Package Shape: ROUND; JESD-609 Code: e0; JESD-30 Code: O-MBCY-T2; Qualification: Not Qualified;
DS9093RB+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; No. of Functions: 1; Terminal Finish: Matte Tin (Sn) - annealed; Technology: CMOS; Qualification: Not Qualified;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; No. of Functions: 1; JESD-609 Code: e0; Terminal Finish: TIN LEAD; JESD-30 Code: X-XXSS-X;
DS9092R-000
MEMORY CIRCUIT; No. of Terminals: 2; Package Shape: ROUND; Package Body Material: METAL; Terminal Position: BOTTOM; JESD-609 Code: e0;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Surface Mount: NO; Qualification: Not Qualified; Terminal Finish: MATTE TIN; Package Body Material: UNSPECIFIED;
DS9093F+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Package Style (Meter): SPECIAL SHAPE; Terminal Form: UNSPECIFIED; JESD-609 Code: e3; Qualification: Not Qualified;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; No. of Functions: 1; JESD-30 Code: X-XXSS-X; Technology: CMOS; Terminal Form: UNSPECIFIED;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Terminal Finish: TIN LEAD; Package Style (Meter): SPECIAL SHAPE; Surface Mount: NO; Package Body Material: UNSPECIFIED;
DS9093P+
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Technology: CMOS; No. of Functions: 1; JESD-609 Code: e3; Qualification: Not Qualified;
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; Surface Mount: NO; Package Style (Meter): SPECIAL SHAPE; JESD-30 Code: X-XXSS-X; Qualification: Not Qualified;
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